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Bourns, a manufacturer and supplier of electronic components for power, protection, and sensing solutions, introduces its second-generation High Clearance/Creepage Distance Isolation Power Transformer Model HCT8xxxxEAL Series.

ByRostyslavMarushchak, Applications Engineer,Renesas Electronics, Lviv,Ukraine

Strengthening its commitment to advanced robotics and enabling technologies applied to industrial automation, Comau joins the ADRA - AI, Data and Robotics Association, which represents the private sector in the European Partnership (PPP) for Artificial Intelligence, Data, and Robotics, within Horizon Europe.

Infineon announced two new CoolGaN product technologies, CoolGaN bidirectional switch (BDS) and CoolGaN Smart Sense.

Raspberry Pi has teamed up with Dolphin Design to incorporate sophisticated power management features into its latest semiconductor projects.

Seica has opened a new 2,200 square meter campus in Strambino, Italy

The handling of dry bulk materials used to be a completely manual process, but it is now being increasingly automated in a drive to reduce both the costs and the risks of injury, while also increasing throughput and accuracy.

NXP Semiconductors has announced a collaboration with ZF on next-generation SiC-based traction inverter solutions for EVs.

TDK has extended its Micronas 3D HAL-position sensor family with the HAL/HAR 3936, the newest addition to its Hall-effect-based 3D-position sensor portfolio.

The ADXL367 from Analog Devices is an ultralow power, 3-axis microelectromechanical systems (MEMS) accelerometer that consumes just 0.89 μA at a 100 Hz output data rate and 180 nA when in motion-triggered wake-up mode.