Search results for "SEMI MEMS"

What will the E/E (electrical/electronic) architecture in thevehicle of tomorrowlook like? And what requirements will this place on thesemiconductorsused?

DELO has carried out internal feasibility studies, demonstrating the successful electrical and mechanical bonding of miniLED dice using directional conductive adhesives.

ElectroRent is bolstering its presence in mainland Europe with a move into a new, larger facility in Mechelen, Belgium.

ROHM and United Automotive Electronic Systems (UAES) have recently entered into a long-term supply agreement for SiC power devices.

The European Processor Initiative (EPI), a project with 27 partners from 10 European countries, with the goal of helping to achieve EU independence in HPC chip technologies and HPC infrastructure has announced the first EPI Forum to be held in Barcelona, Spain, October 9-10, 2024.

Following his achievement of the 2024 Millennium Technology Prize, Electronic Specifier recently spoke with the inventor of the IGBT, Professor Bantval Jayant Baliga, on what it means to him and what he hopes to see in the future.

Navitas Semiconductor has announced the launch of its third-generation automotive-qualified SiC MOSFETs, available in D2PAK-7L (TO-263-7) and TOLL (TO-Leadless) surface-mount (SMT) packages.

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.

Nordic Semiconductor has announced the availability of its smallest and lowest power System-in-Package (SiP) - the nRF9151, and its associated nRF9151 Development Kit (DK).

Nordic Semiconductorhas confirmed that its upcoming nRF54L and nRF54H Series Systems-on-Chip (SoCs) will support Channel Sounding, a key feature in the newly adopted Bluetooth 6.0 specification.