Search results for "Master Bond"
NIO opens Berlin Innovation Centre
NIO has officially opened its new 1,500 square metre Innovation Centre in Berlin, Germany.
Smart graphene paper allows for rapid testing
Chih-Jen Shih and Andrew deMello, chemical engineers from ETH Zurich, have spearheaded a project to create a fast-testing system using advanced graphene paper.
How to realise power-saving analog-to-digital conversion for highly accurate measurements
This article presents a low-power analog-to-digital converter (ADC) solution for high-precision measurement applications.
Henkel launches LOCTITE Xplore
The LOCTITE Xplore e-learning platform brings together over 65 years of combined product, industry, application, and engineering expertise.
ZF electromobility and networked chassis technology
ZF has unveiled its self-developed thermal management system for electric vehicles at its annual Global Technology Day demonstration event.
SEMI 3D & Systems Summit 2023 opens with HI and SiP solutions
3D integration and systems for semiconductor manufacturing applications will take centre stage at SEMI 3D & Systems Summit as the event opens with experts sharing the latest developments and insights into the 3D roadmap, heterogeneous integration (HI) and system-in-package (SiP) technologies for smarter systems. Registration is open for the 26th – 28th June summit in Dresden, Germany.
TEWS Technologies extends mPCIe module family into communications
TEWS extends its tradition of delivering high-density I/O solutions with the introduction of a synchronous/asynchronous standard full PCI Express Mini Card module with three high-speed serial data communication channels. The TMPE863 is designed for data communications, LAN/WAN networking, traffic control, simulation, telecommunications, and COTS applications.
Bostik presents a new instant adhesives precision dispensing system
The R&D team at Bostik’s Born2Bond engineering adhesives brand has revealed details of a new precision dispensing system at the in-adhesives symposium, which enables the easier use of cyanoacrylate adhesives in high-precision robotic manufacturing to bond automotive and electronics product parts with complex shapes and geometries.
Keysight enhances PathWave EDA software suite
Keysight Technologies has unveiled its PathWave Advanced Design System (ADS) 2024 electronic design automation (EDA) software suite.
AI and Big Data Expo North America tickets are now live
Tickets are now available for the upcoming AI & Big Data Expo North America, taking place on the 17-18thMay 2023 at the Santa Clara Convention Centre, California.