Search results for "LASER COMPONENTS"

Amphenol RFis pleased to announce the expansion of its non-magnetic offerings with new SMPMPCB designs.

On 4th September 2024,Silicon Labsannounced support forBluetooth Channel Soundingtechnology on its xG24 platform, marking a significant step forward in Bluetooth Low Energy (LE) ranging capabilities.

Kongsberg Discovery is pleased to announce a significant milestone in the development of its AUV HUGIN Endurance, following a record-setting, fully autonomous multi-week mission.

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.

Small and mid-sized electronics manufacturers in the UK are facing a ‘silent killer’ as new figures show profitability has dropped, despite strong sales.

Max Nentwich, Head Laser Development Engineer atCambridge Vacuum Engineering(CVE), has been elected Vice-Chair of the International Institute of Welding’s Commission IV: Power Beam Processes.

Eggtronichas unveiled an evaluation board (EVB) that allows engineers to speed the development and reduce the size and cost of 240W power delivery (PD) 3.1 applications while supporting ultra-fast charging.

Ultrafast laser systems developed by Chromacity are driving advancements in quantum-enhanced optical systems, which hold significant potential for ultra-secure long-distance optical communications.

Asahi Kasei Microdevices (AKM) has opened its new "AKM Co-creation & Technology Centre" in Yokohama City, Kanagawa Prefecture, Japan, in June 2024.

Industrial robotics has undergone a remarkable evolution in recent years, driven by advancements in semiconductor technology and the increasing demand for smarter, safer, and more efficient systems.