Search results for "ASIC"

Power rail probes will make their debut on the Tektronix exhibit at the embedded world exhibition in Nuremberg (February 26-28). The TPR1000 and TPR4000 boast 1mv accuracy. Designed specifically for minimising noise on power rail measurement, the power rail probes enable clean, ultra-low noise measurement insight, with up to 60V offset.

As optical networks are transitioning from 100G to flexible transmission rates that scale up to 600G to support hyper-connected architectures, new flexible multi-rate optical transmission devices and software are needed. Microchip Technology, through its subsidiary, Microsemi, and Acacia Communications, are supporting this critical transition.

This reference design from Texas Instruments provides an example of how to power FPGAs, ASICs, or MCUs in industrial sensor applications when space-constraints are a primary concern. The wide six to 60V input voltage range and the use of ultra-small and highly efficient DC/DC converters makes the design well suited for applications like industrial sensors, field transmitters, motor drives, and PLC modules.

The embedded world 2019 exhibition in Nuremberg (February 26-28) will give Rigol Technologies the opportunity to present a number of innovations alongside the company’s established and proven instruments for test and measurement applications.

A wide range of measurement solutions will be showcased by Tektronix at embedded world in Nuremberg (February 26-28, 2019). The Tektronix stand will feature four workstations, including demonstrations on Embedded Design, Power Electronics, Automotive Solutions and Education & Research.

A fast measurement speed, achieved within tight cost and size constraints while integrating the primary conductor in SO packages without compromising the necessary insulation, is often as critical as the other high performances for current measurement in motor-drive applications. That is why LEM’s GO miniature transducers have been designed to achieve a 2µs response time from 2 standard, cost-effective SO8 or SO16 packages for nominal...

With sensors providing the essential steps of analysing and communicating high-level data to cloud-based applications, a collaboration between Molex and Contrinex aims to further strengthen Molex’s Industrial Internet of Things (IIoT) solution offerings and positions the company as an end-to-end solution provider for industrial automation.

Automotive electronics testing is one of the most exacting of all test and qualification protocols before production release because of the safety and liability considerations. The AEC Q100 revisions, ZVEI and its French equivalent SIA for accelerated environment stress tests not only list the time or number of cycles that batches of samples have to be tested for, but ISO26262 also defines the set of mission profiles per product application in th...

Human Machine Interfaces (HMI’s) used in hazardous or industrial applications have a difficult life, and their designers face many challenges when integrating interactive technologies into these systems. A new generation of touch controllers will transform the design of industrial projected capacitive (p-cap) touchscreens, with technical innovations that deliver better performance and functionality than before.

The first customer shipment of a new 130nm manufacturing process node based FFSA (Fit Fast Structured Array) development platform, has been announced by Toshiba Electronics Europe (Toshiba). This innovative high performance System-on-Chip (SoC) development platform delivers custom solutions that feature low power consumption at a low cost point.