Search results for "SiC MOSFET"
Peregrine - Low-Frequency Passive Mixer Targets UHF-900MHz Applications
Peregrine Semiconductor has announced the release of its newest UltraCMOS RFIC, the 50-ohm PE4150 quad MOSFET core device, ideal for mixer designs requiring low conversion loss and high linearity such as portable radios operating in bands from UHF through 900MHz. The PE4150 is a highly linear passive mixer that incorporates an integrated LO amplifier with exceptionally high LO isolation.
Pulse-Width Modulator from Microchip
Microchip has announced the MCP1631 2.0 MHz, high-speed Pulse Width Modulator (PWM). The MCP1631 PWM provides a means to close the feedback loop in Switch-Mode Power Supplies (SMPSs) that use microcontrollers for general system intelligence and control. The integration of the SMPS input and output interfaces in the MCP1631, via its high-speed voltage comparator, battery-voltage and current-sense amplifiers, and its 1A MOSFET driver, enable design...
Microchip Announces 500mA MOSFET Drivers in SOT-23 and 2x3mm DFN Packages
Microchip announces the MCP1401 and MCP1402 (MCP140X) single-output MOSFET drivers. The inverting MCP1401 and non-inverting MCP1402 MOSFET drivers are rated for a peak output current of 0.5A, over a wide operating voltage range of 4.5V – 18V. They have excellent latch-up immunity and are available in miniature, 2 x 3 mm DFN and 5-pin SOT-23 packages.
Arrow Electronics and Dawin Electronics sign distribution agreement for EMEA
Arrow Electronics will distribute products and solutions from Dawin Electronics in the EMEA region. Semiconductor manufacturer Dawin, based in Incheon, Korea, produces diode, IGBT, MOSFET, thyristor and rectifier modules, as well as discrete components. Dawin, which was founded in 2001, produces application-specific modules that are tailored to customer requirements and is certified in accordance with ISO 14001, ISO 9001 and South Korean standard...
Power MOSFETs for automotive motion control
Toshiba has launched a new range of power MOSFETs that is optimized for motors used in fans, pumps and other automotive motion control applications. The new MOSFETs combine industry-leading on-resistance and input capacitance ratings with a package design that offers better thermal dissipation and power cycling capabilities than previous automotive MOSFETs.
Toshiba Electronics to showcase advanced semiconductor solutions for automotive designs
At Electronica 2010 Toshiba Electronics Europe (TEE) will be showcasing a selection of advanced semiconductor solutions for automotive applications and presenting a paper on new microcontroller technologies for automotive safety systems.
Microsemi Expands Support for Designers Developing Next-generation High-voltage, High-power RF Generators
Comprehensive Guide Helps Overcome Design Challenges and Speed Development of Advanced, Low-cost RF Systems
Microsemi Commemorates 55 Years in Space and 10,000th Radiation-Tolerant RTAX-S/SL FPGA Shipment
Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced it has shipped its 10,000th radiation-tolerant RTAX-S FPGA device for flight-critical applications. Microsemi has also shipped tens of thousands of its previous generation spaceflight FPGAs.
Change of Guards at FINAT, Newly appointed president Kurt Walker shares his vision on FINAT’s strategy today and tomorrow
FINAT, the world-wide association representing the interest of the self-adhesive labelling industry, announces that Kurt Walker has been appointed new president for FINAT at their annual congress in Sicily this year. Kurt Walker takes over the presidency from Andrea Vimercati to steer FINAT for the next two years. Mr Walker (°1950), currently CEO at tesa Bandfix Switzerland, became a member of the FINAT board in 1999. Until now he took up his...
NMI & IMAPS-UK have announced the line up for their iPower Technical Conference, which takes place at the WMG, University of Warwick on 30 November & 1 December 2011.
The two-day event and networking dinner, supported by Dyson, will focus on how future products can integrate interconnectivity, intelligence and thermal management to better meet the needs of renewable power generation, electric vehicles, smart transportation systems and other applications. Presentations will be given on scenario and application directions; power electronics technology developments; materials and processes; and manufacturing and...