Search results for "EMS"

Akrometrixwill display its latest surface measurement equipment platform, the CXP, on the Microtronic Booth (7-101L) at SMT Hybrid Packaging, which is scheduled to take place from 5th to 7th May 2015.

Microtronic will display a range of products in Booth 7-101L at SMT Hybrid Packaging, scheduled to take place 5th to 7th May, 2015 at the Messe in Nuremberg, Germany. At the booth AIM will highlight specialty soldering materials in alloys of indium, tin, lead, bismuth, cadmium, gold and gallium for a wide range of joining applications.

The electronics industry is developing all the time. Changing manufacturing requirements and the needs of future markets must be taken into account. To meet these challenges, productronica has collaborated closely with its exhibitors and trade associations to optimise the exhibition.As a result, a new ‘cluster’ structure will give visitors to productronica’s 40th anniversary event in November this year, a unique overview of the ...

Customers of CEM firm Exception EMS will start to reap the rewards of the recently completed first phase of the implementation of FactoryLogix, a manufacturing execution system from Aegis. After a careful selection process Exception EMS is investing over £300k in an improved production system based around the Aegis FactoryLogix platform. This will give Exception EMS the ability to have improved processes controls, real time insights on prod...

Designers of antennas and high speed printed circuit boards can cut testing times drastically by using scanners introduced by MDL Technologies. The benchtop scanners from EMSCAN provide real-time images of EMI and antenna emissions, enabling designs to be evaluated in seconds.

With innovations and advanced technologies, electronica China 2015 and productronica China ended successfully at the Shanghai New International Expo Center, on March 19, 2015. The three-day trade fair covered 57,500 square meters of exhibition space. A total of 1,006 exhibitors from 28 countries and regions gathered to showcase their latest technologies and services. 55,365 visitors participated at this year’s show.

Two conference sessions, two workshops and 17 German and English tutorials concerning all aspects of system integration in microelectronics make up the programme at SMT Hybrid Packaging 2015 on 5th to 7th May.

Rohde & Schwarz is lining up an array of solutions for electromagnetic compatibility (EMC) measurements at the EMV 2015 exhibition in Stuttgart. Highlights will include compliance tests in the 5 GHz band, tried and tested EMC software with enhanced functionality and broadband amplifiers with expanded frequency ranges.

STI Electronics announces that it has been awarded IPC J-STD-001, IPC-A-610 and IPC J-STD-001 Space Addendum Qualified Manufacturers Listing (QML). STI is the first training centre to receive IPC's Validations Services QML.

Engineered Material Systems has introduced the DB-1541-S9 conductive adhesive for stringing or shingling applications in crystalline silicon and thin-film solar modules. The adhesive is stress absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallisation during damp heat exposure.