Search results for "ICs"
Infineon launches SOLID FLASH Technology for its New Generation of Security ICs Based on 90nm Technology
Infineon today at the “Cartes & Identification” Trade Show in Paris announced the introduction of 90nm SOLID FLASH™ technology for its new generation of security ICs. With SOLID FLASH, Infineon is the worldwide first supplier of security products combining the advantages of highly flexible and reliable Flash with outstanding and secure contactless performance, targeting applications like payment, government ID, high-end mobile communicatio...
Infineon First Semiconductor Supplier to Offer “80 PLUS Platinum” Compliant Computing Silver Box Reference Design
Infineon Technologies has developed the first marketable silver box reference design that enables PC and server power supply units to achieve up to 92.35 percent efficiency, while significantly reducing the material costs. Infineon’s solution IFX90ATX300W is based on the latest generation of three ICs (Integrated Circuits) and meets the industry’s highest energy efficiency standard: “80 PLUS® Platinum”. Efficiency indicates what share of...
Infineon to Supply Next Generation of Security Controllers for German ID Cards, Europe’s Biggest ID Project
Infineon is supplying its next generation of security controllers of the SLE 78 product family for the new German ID card. The German authorities have been issuing the new electronic ID in chip card format since November 1, 2010. Infineon is providing a significant share of the chips for Europe’s biggest ID project. Currently, around 60 million German ID cards are in circulation, usually valid for ten years. About 6.5 million ID cards are issue...
Aeroflex - AX-Series for characterization and production test of consumer RF and mixed signal semiconductors
Aeroflex launched the AX-Series at SEMICON West today, a completely new product line for characterization and production testing of consumer RF and mixed-signal semiconductors.
Cypress Introduces High-Performance Buffer Family With Industry's Lowest Jitter
Cypress Semiconductor Corp. today introduced a new clock buffer family that offers the industry's lowest additive RMS phase jitter. The CY2Dx15xx family features additive RMS phase jitter as low as 60fs while delivering propagation delays as low as 480ps. More information about the new buffers is available at http://www.cypress.com/go/HighPerformanceBuffers.
Shortlink adds ultra low power RF transceiver to ASIC building block portfolio
Shortlink announced today the introduction of an ultra low power RF transceiver to its growing ASIC building block portfolio. Consuming just 8mA, the transceiver is the first variant in a family of customisable transceivers and uses less than 50% of the power of typical discrete RF modules or transceiver ICs.
Magma’s Quartz DRC Physical Verification Solution Qualified to Support GLOBALFOUNDRIES’ DRC+ Flow for Technologies at 28 nm and Below
Magma Design Automation has announced that the new pattern matching capability in the Quartz DRC physical verification product has been qualified to support DRC+, GLOBALFOUNDRIES' silicon-validated, yield-critical pattern-based design for manufacturing (DFM) verification flow for all advanced process technologies, including 40 nanometer (nm), 28 nm and below.
GN ReSound Standardizes on Magma Talus to Increase Performance and Minimize Power on Next-Generation ICs
Magma Design Automation has standardized on the Talus® implementation system for its next-generation ICs. GN ReSound selected Talus after encountering difficulty closing timing while meeting low-power requirements on a critical design with its previous tools. Talus delivered a fast, predictable and repeatable flow that allowed GN ReSound to quickly perform trial place-and-route runs to find the optimal power/performance tradeoff.
Magma Acquisition by Synopsys to Provide Customers with State-of-the-Art Mixed-Signal, Digital and Analog Design Solutions that Enable More Profitable Silicon
Magma Design Automation has announced the company has entered into a definitive agreement to be acquired by Synopsys. The combination of the two companies’ technologies, development capabilities, support teams and sales channels will provide chip designers with greater access to state-of-the art electronic design automation (EDA) solutions that enable more profitable silicon.
AssemblÉon Robot Reduces Cost Of Memory Module And Back-end Semiconductor Manufacturing
Royal Philips Electronics subsidiary Assembléon’s recently released Twin Placement Robot (TPR) is reducing the cost of placement for memory module assembly, and will soon be doing the same for semiconductor backend manufacturing. The TPR fits on Assembléon’s A-Series pick & place equipment to give a single platform that can place up to 110,000 ICs and chip components per hour – eliminating the need for a separate line balancing machine. T...