Search results for "e waste"
Laird Thermal Systems new line of micro thermoelectric coolers
Laird Thermal Systems launches the OptoTEC MBX Series, a line of micro thermoelectric coolers for high-performance space-constrained optoelectronic applications.
Advantest features SoC test system at SEMICON Europa
Advantest will showcase its latest test solutions at SEMICON Europa 2024 in Munich (November 12-15).
Applications processors deliver secure connectivity
NXP Semiconductors has released the i.MX 94 family, the newest addition to its i.MX 9 series of applications processors, designed for industrial control, programmable logic controllers (PLCs), telematics, industrial and automotive gateways, and building and energy control.
NXP rolls out wireless BMS with UWB at electronica
NXP Semiconductors has unveiled what it says is an industry-first wireless battery management system (BMS) solution with Ultra-Wideband (UWB) capabilities.
SoM suits compact, cost-optimized edge devices
Variscite has announced, the DART-MX91, the newest member of its SoM DART Pin2Pin family.
New TI MCUs enable Edge AI
Texas Instruments (TI) introduced two new series of real-time microcontrollers that deliver advancements to help engineers achieve more intelligent and secure processing inautomotiveandindustrial applications.
STMicroelectronics’ unveils new series of motor drivers
STMicroelectronics has extended the STSPIN32 series of integrated motor drivers, adding eight new products to tackle cost-sensitive yet performance-hungry applications including power tools,home appliancesand industrial automation.
Custom cable solution for sliding components
Junkosha has chosen SEMICON Europa to announce the launch of its EPTFE Flat Cable designed for critical components inmanufacturing and inspection equipment.
Samsung showcases innovations for AI and automotive
Samsung Semiconductor Europe is presenting innovations in next-generationsemiconductor technologiesfor artificial intelligence (AI), automotive, and beyond at booth B6.602 at electronica 2024 from November 12-15 in Munich.
Industry’s most advanced analog and mixed-signal platform
onsemi introduced the Treo Platform, ananalog and mixed-signal platformbuilt with Bipolar-CMOS-DMOS (BCD) process technology on an advanced 65nm node.