Search results for "NTT Corporation"
Indium Corporation expert honoured by IEEE EPS
Indium Corporation Strategic Advisor Dr. Dongkai Shangguan was honoured by the IEEE Electronics Packaging Society (EPS) with its 2023 Electronics Manufacturing Technology Award at the 73rd Electronics Components and Technology Conference (ECTC) in Orlando, FL.
“EU chips investment drop in bucket in grand scheme”
Spurred by the pandemic and its resulting supply-chain issues, and punctuated by the invasion of Ukraine, a new chip-war between the West and East has seen a revaluation of the role micros and semiconductors play in countries’ economies and a concerted effort to shore up supplies.
Nidec and Renesas collaborate on semiconductor solutions for next-generation E-Axle for EVs
Nidec and Renesas Electronics have agreed to join forces on the development of semiconductor solutions for a next-generation E-Axle (X-in-1 system) that integrates an EV drive motor and power electronics for electric vehicles (EVs).
Advantest expands M4841 handler with active thermal control
Semiconductor test equipment supplier Advantest has announced a new Active Thermal Control (ATC) option for its M4841 high-volume device handler.
Mitsubishi Electric and Mitsubishi Heavy to Integrate power-generator systems businesses
Mitsubishi Electric Corporation and Mitsubishi Heavy Industries announced that they have reached a definitive agreement to integrate their power-generator systems businesses under a joint venture.
Novocomms announces new vision for global growth
Novocomms has announced ambitious growth plans for the next five years, including the establishment of three manufacturing divisions, with the potential to create up to 300 new jobs in Birmingham.
Partnership drives innovation in 3D manufacturing
J.A.M.E.S, the collaborative community for additively manufactured electronics (AME) development, is pleased to announce its partnership with Fuji Corporation, a specialist manufacturing company known for its innovative technologies. This partnership aims to drive innovation in the 3D manufacturing industry by combining the expertise and resources of both companies.
BASF strengthens R&D with more powerful supercomputer
BASF has started up a new supercomputer at its Ludwigshafen site to replace the existing one. With 3 petaflops of computing power, the new supercomputer is considerably more powerful than its 1.75 petaflop predecessor.
NXP brings multimedia to mass-market two-wheelers
What's new: NXP Semiconductors has announced a combined digital instrument cluster and connectivity reference platform designed for mass-market two-wheelers, including motorcycles, electric scooters, commuter bikes, and more.
Siemens launches Tessent RTL Pro for EDA design-for-test
Siemens Digital Industries Software has unveiled Tessent RTL Pro, a software solution developed to help integrated circuit (IC) design teams streamline and accelerate a broad array of critical design-for-test (DFT) tasks for their next-generation designs.