Search results for "fibre optic"

Colour accuracy of a camera is the measure of how accurately it can reproduce the colour from the real world. In other words, it measures the degree to which the colours displayed or captured by a device match the intended or reference colours. Cameras need to have a supreme colour accuracy to produce realistic and consistent images from the real world.

Lumotive and Hokuyo Automatic have announced the commercial release of the YLM-10LX 3D lidar sensor.

Test Research Inc. has announced a collaboration with NVIDIA and leading Taiwanese electronics manufacturers to accelerate the deployment of AI-driven technologies for smart factories.

Zebra Technologies, one of the leading digital solution providers enabling businesses to intelligently connect data, assets, and people, has introduced the FS42 fixed industrial scanner and 3S Series 3D sensors as it continues to power secure technology innovation around AI and industrial automation for the manufacturing industry to help increase operational efficiency.

At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...

Microscopic cameras play a major role in medical applications for surgery, pathology, and diagnostics.

Resolve Optics has announced the opening of new cleanroom facilities at its Chesham, UK headquarters.

A ‘treasure trove’ of data, including papers authored by UK scientists, has been released from the Euclid space telescope.

Automation and Smart Factory concepts are seamlessly integrated at Seica's booth 4A-120 at SMT in Nuremberg, where cutting-edge solutions cater to both.

In 2024, Pickering Interfaces is celebrating 25 years of supporting PXI (PCI eXtensions for Instrumentation), the scalable, high-performance modular instrumentation standard first introduced in 1997.