Search results for "teledyne"
MSEC 2023 commences, highlighting sensorisation as a driver for global innovations
The MEMS & Sensors Executive Congress (MSEC 2023) at the WIGWAM Resort in Phoenix, Arizona, begins its proceedings today, shining a light on the latest sensorisation trends and their transformative impact on key growth sectors.
Alpha Data unveils ADK-VA601 AI dev kit
Alpha Data has launched its ADK-VA601 Versal AI Core Development Kit for Space 2.0.
Teledyne LeCroy supports PCI Express 6.0 electrical testing
New PCI Express 6.0 and software tools support faster 64 GT/s data transfer speeds using PAM4 multi-level signalling.
Flame detection made even easier with the latest Spyglass series
Teledyne Gas and Flame Detection have unveiled its Spyglass SG50-F series of flame detectors to make the safeguarding of people and assets easier than ever before.
SEMI MEMS and Imaging Sensors Summit
Innovation will take centre stage at the SEMI MEMS & Imaging Sensors Summit as the event opens at the World Trade Centre in Grenoble to provide the latest insights into new opportunities for MEMS, imaging and sensors applications and their potential to enable a smarter and more sustainable world.
The quest for innovation
Solid State Supplies is a company excited by new technologies and the possibilities they open up.
Thermal by FLIR powered mobile phones and smart building sensor featured at MWC
Teledyne FLIR, part of Teledyne Technologies Incorporated, has welcomed new editions to its lineup of Thermal by FLIR products that will be shown at Mobile World Congress (MWC).
SEMI MEMS & Imaging Sensors Summit
More than 40 experts will gather on the 19th – 21st September at the SEMI MEMS & Imaging Sensors Summit to share insights into new innovation opportunities for MEMS, imaging and sensors applications and their potential to enable a smarter and more sustainable world.
Anthony Fernandez joins Sondrel as COO
Sondrel has appointed Anthony Fernandez (pictured) as its new COO. He joins from Refeyn where he was CEO. Previously he was VP Asia Pacific for Teledyne Technologies.
Partnership optimises processor boot solution for edge computing space systems
Infineon Technologies and Teledyne e2v have developed a reference design for the implementation of compute-intensive space systems.