Search results for "advanced engineering"

General Silicones (GS), a silicone products OEM/ODM manufacturer, will be showcasing its latest innovations at electronica 2024, the premier trade fair for electronics.

BAE Systemswill invest £220 million to upgrade its facilities in Rochester, Kent. The site, which is home to the company’s UK-based Electronic Systems business, will undergo significant renovation to create a new state-of-the-art factory of more than 32,000 square-metres.

A breakthrough in 3D-printing concrete by researchers at the University of Virginia has been achieved. The team have developed a sustainable and printable cementitious composite that combines graphene with limestone and calcined clay cement (LC2), enhancing both strength and durability while decreasing carbon emissions.

The National Robotarium is supporting the development of new artificial intelligence and control systems that could allow underwater robots to operate autonomously and with high precision in turbulent seas, potentially revolutionising maintenance and repair tasks for offshore wind turbines.

The LoRa Alliance, the global association of companies backing the open LoRaWAN standard for internet of things (IoT) low-power wide-area networks (LPWANs), has announced the appointments of Alper Yegin as CEO and Olivier Beaujard as Board Chair. Together, they strengthen the Alliance’s leadership as the LoRaWAN standard enters a phase of rapid global deployments to serve Massive IoT.

Allegro MicroSystems, a pioneer in sensing and power solutions for motion control and energy-efficient systems, will be attending electronica 2024, to showcase its latest innovations in sensing and power.

Explore the key benefits of choosing a desktop CNC machine, with examples of how they can be applied in different contexts.

Researchers from MIT have stumbled upon a unique chain of materials that could enable the3D printingof active electronics. This discovery marks the first successful creation of semiconductor-free, 3D-printed logic gates and resettable fuses.

Farnell has added the new NI mioDAQ device to Emerson’s USB data acquisition (DAQ) product line. It is Emerson’s most powerful bus-powered USB DAQ device to date, designed to simplify setup and enhance performance for engineering teams.

Haptic technologiesdeliver feedback through the sense of touch, from simple vibration alerts all the way to immersive tactile interactions. In 2024, the largest market for haptics is in smartphones, but as the smartphone market stagnates, the industry is looking towards automotive interiors as the major opportunity for the next decade.