Search results for "Nexperia"

General-purpose, CMOS, bi-directional, 4 or 8-channel analog switches by Nexperia with a 1.5V to 5.5V operating voltage range. NMUX130x series provides improved measurement precision with injection current while extending the digital logic thresholds to be compatible with 1.8V systems without the need for voltage translation.

Würth Elektronik eiSos Group will be represented with its own booth at the PCIM Expo in Nuremberg, running from 6-8 May, 2025.

Nexperia has announced that its GaN FET devices, featuring next-gen high-voltage GaN HEMT technology in proprietary copper-clip CCPAK surface mount packaging, are now available to designers of industrial and renewable energy applications.

Nexperia has announced a strategic partnership with Mitsubishi Electric Corporation to jointly develop silicon carbide (SiC) MOSFETs.

Semiconductor manufacturers are continuously pushing the boundaries of their process technologies to enable designers, in turn, to explore the limits of existing circuit topologies while also developing new ones.

Altus Group has announced the successful implementation of the Essemtec Fox MFC Pick and Place system at Nexperia's Stockport facility.

As the pioneers of copper-clip packaging technology, Nexperia bring20 years’ expertise in high-quality, robust SMD packaging to itsGaN FET portfolio. Adopting proven technology, CCPAK gives industry-leading performance in an innovative package. The copper-clip, cascode designoptimizes thermal and electrical performance making them ideal to meet the demands of next-generation industrial and renewable energy applications.

Mouser Electronics has extended its portfolio of electrostatic discharge (ESD) protection components.

Nexperia has announced its first SiC MOSFETs with the release of two 1200 V discrete devices in 3-pin TO-247 packaging with RDS(on) values of 40 mΩ and 80 mΩ.

Space-saving, thermally efficient, and robust semiconductor packages are needed for transistors and diodes. And while for many product generations, designers have relied on established packages like the SOT23 and SMA families, we see the high performing clip-bond and leadless package outlines such as CFP and DFN clearly winning on value for money.