Search results for "Master Bond"
The new SCIGRIP SG400LSE from IPS Adhesive
IPS Adhesives has introduced the new SCIGRIP SG400LSE adhesive, requiring no surface preparation and featuring low sag, as well as short working and fixture times.
Melexis opens its largest wafer testing site in Malaysia
Melexis has opened its largest wafer testing site worldwide in Kuching, Sarawak, Malaysia.
Ipri-Brown Begins Term as ASME’s 143rd President
Susan Ipri-Brown has begun her term as the 143rdpresident of the American Society of Mechanical Engineers (ASME), the Society announced during its annual meeting 4thJune 2024.
Lumus and AddOptics to directly bond waveguides with prescription lenses
Lumus has announced a strategic partnership with AddOptics, a provider of advanced prescription lens solutions, to enhance immersive AR glasses experiences globally.
Anritsu and Y.I.C. join to deliver EMI solutions
Anritsu has partnered with Y.I.C. Technologies to develop groundbreaking tools that support companies performing EMC pre-compliance measurements.
Certifying medical device quality management systems with ISO 13485
By Dr. Itoro Udofia, Director, Medical Health Service at TÜV SÜD
The International Semiconductor Alliance at PCIM Europe 2024
The International Semiconductor Alliance (ISA) will be presenting state-of-the-art solutions for manufacturing and process optimisation in the semiconductor industry at this year's PCIM 2024 in Nuremberg.
A.R.T. to exhibit at SMTconnect
Advanced Rework Technology (A.R.T.) will exhibit at the SMTconnect exhibition in Nuremberg, Germany, June 11th – 13th, on the What’s New in Electronics pavilion, Hall 4 227.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...
Anritsu introduces new analysers
Anritsu Corporation is pleased to introduce its latest advancements in field testing equipment: the Site Master MS2085A Cable and Antenna Analyser and the MS2089A with Integrated Spectrum Analyser.