Search results for "KYZEN"

Taking place 14th-16th February 2017, the 2017 IPC APEX EXPO will see KYZEN exhibiting in booth 2401 at the San Diego Convention Center in California.The KYZEN team is excited to demonstrate the new KYZEN ANALYST Real-Time Concentration Monitoring and Reporting System.

Plans to exhibit with distributor, Kreative Technologies in Booth 3429 at Productronica India have been announced by Kyzen, taking place 21st-23rd September in Bangalore.The KYZEN team will highlight IPA replacements and its AQUANOX A4625 versatile aqueous cleaning chemistry.

KYZEN’s Dr Mike Bixenman will present the paper “BTC/QFN Test Board Design Considerations and Method for Qualifying Soldering Materials and Cleaning Processes” at SMTA International. The paper is co-authored by Mark McMeen and Jason Tynes from STI Electronics.

KYZEN has introduced solvent blends designed to be reliable across a wide spectrum of industrial cleaning applications. From “vapor only” to immersion, ultrasonics and turbulation, these formulations are said to meet or exceed almost any process requirements in place today.

Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference, scheduled to take place October 25-27, 2016 at Hyatt Rosemont, Rosemont, IL. The conference is focused on best practices for designing, cleaning and coating highly dense electronic assemblies to assure reliability in today’s mobile society.

KYZEN has announced plans to reveal new research findings at NEPCON South China. Demonstrated improvements for a multitude of standard processes, solder pastes and laboratory conditions are being made available to help industry experts. Key findings and related video proofs also will be shared during the event.

SMTA China presented awards for several papers at its 10thAnniversary Reception, held in conjunction with the NEPCON South China Show.

KYZEN just announced plans to exhibit at SEMICON West (July 12-14) in San Francisco. KYZEN will exhibit MICRONOX MX2302 for wafer bumping, Ionox FCR for wire bonding and MICRONOX 2707 for Cu pillar flip chip applications.

KYZEN will exhibit at NEPCON West China (21-23 June) in Chengdu, China. KYZEN cleaning will showcase safe IPA alternatives to improve the cleaning process and increase production yields. The company offers cost-effective cleaning chemistries designed specifically for contract manufacturing, stencil and maintenance applications.

KYZEN’s Dr Mike Bixenman is set to present at the Advanced Selective Soldering Process Seminar (June 28) at Kester’s Global Headquarters in Itasca, IL. KYZEN also is a sponsor for the event.