Search results for "Toshiba"
Smart gate driver photocoupler for medium power IGBTs
Suitable for driving medium power IGBTs and power MOSFETs, Toshiba Electronics Europe has announced the launch of a new smart gate driver photocoupler (TLP5214A). The TLP5214A is intended for multiple applications where MOSFETs and IGBTs are used including industrial inverters, solar energy inverters, air conditioner inverters and servo amplifiers.The TLP5214A integrates such features as desaturation leading edge blanking time, filtering time, an...
Enterprise-class SSDs with 64-layer 3D flash memory
Two new enterprise solid state drive (SSD) solutions have been developed by Toshiba Electronics Europe, the TMC PM5 12Gbit/s SAS series and the CM5 NVM Express (NVMe) series. Development is expected to be completed in the fourth quarter. Both product lines are built with TMC’s latest 64 layer, 3-bit-per-cell enterprise-class TLC (triple-level cell) BiCS FLASH, making it possible for today’s demanding storage environments to expand the...
Next-gen client SSD optimised for notebook PCs
Delivering better transfer speeds and power efficiency, Toshiba Electronics Europe has announced the new SG6 series, the latest Toshiba client SSD to feature 64-layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH. This family of SSDs is designed for mainstream desktops and notebooks, consumer upgrades, as well as applications needing data security.
Industrial robotics to showcase at the Robot Investments Show
The third annual Robot Investments Show is taking place on the 4th-6th October 2017 at the WOW convention centre in Istanbul. Entek, distributor ofIndustrial robot specialistTM Robotics, will be exhibiting an array of Toshiba machine robots, showcasing their capabilities to those looking at making an investment in industrial robotics.
Single package SSDs reduce size of IoT devices
Based on its latest 64 layer, 3-bit-per-cell TLC (triple-level cell) BiCS FLASH, Toshiba Electronics Europe has announced the availability of the BG3 series, its next-gen single-package ball grid array (BGA) solid state drive (SSD) product line. Designed to fuel the future of mobile devices, Toshiba claims that the BG3 SSDs deliver better performance and a smaller footprint than traditional SATA-based drives.
Image recognition processor powers active safety system
Toshiba Electronic Devices & Storage has announced thatDENSO is deploying Visconti4, its latest image-recognition processor dedicated to automotive applications, in next-gen, front-camera-based active safety systems. Visconti4 is a multi-engine road-safety solution that provides drivers with real time analytics of road conditions and potential dangers.
BLE products support new Bluetooth mesh standard
Toshiba Electronics Europe's line-up of BluetoothLow Energy products now offers support for the Bluetooth Mesh standard. This standard was ratified and launched by the Bluetooth Special Interest Group (SIG). The combination of new Bluetooth Mesh standard 1.0 and Toshiba’s application software enables Toshiba Bluetooth Low Energy products to simultaneously increase communication range, reliability and obstacle penetration capability while al...
Investigating the automotive embedded systems market
The technological advances in the electronics and telecommunications sector have enabled the development of various advanced systems in the automotive industry. The seamless integration of embedded systems in vehicles has enhanced their functionalities to provide services related to navigation, diagnostics, Internet connectivity, and advanced driver assistance systems (ADAS). Thus, the modern vehicle has grown beyond just a means of transport.
Affordable and lightweight robots on display at Motek 2017
Industrial robot company, TM Robotics, is exhibiting at Motek in Stuttgart, Germany from 9th to 12th October 2017. The international trade fair claims to be the world’s leading event in the realm of production and assembly automation. TM Robotics will be exhibiting alongside Swiss automation specialist, Elmotec, in exhibition hall seven, booth 7202.At the event, TM Robotics will be showcasing the Toshiba Machine THL SCARA robot, part of the...
World’s first 3D flash memory comes with TSV technology
Toshiba Memory has announced development of the world’s first BiCS FLASH three-dimensional (3D) flash memory utilising Through Silicon Via (TSV) technology with 3-bit-per-cell (triple-level cell, TLC) technology. Shipments of prototypes for development purposes started in June, and product samples are scheduled for release in the second half of 2017. The prototype of this ground-breaking device will be showcased at the 2017 Flash Memory Sum...