Search results for "RF design"
Avnet Silica promises demos, events and convos at electronica
Avnet Silica will spotlight its leading-edge technologies and supplier products, host interactive knowledge sessions, and provide unique networking opportunities at electronica 2024 in Munich (November 12-15).
Fanless 300W DC/DC converter “Made in Germany”
The BICKER DC300WS is a universal and powerful DC/DC converter with a very high efficiency of up to 98%. It offers an ultra-wide input range of 6...36VDC and allows a flexible choice between 12V, 19V and 24V output voltages. The high-quality DC300WS is the ideal power supply for motherboards featuring the latest Intel® Core™ processors. These CPUs have a highly dynamic power consumption with sometimes extreme performance jumps within a ...
10 years of UK National Quantum Technologies Programme
The UK National Quantum Technologies Programme (NQTP) is marking its tenth anniversary at the UK National Quantum Technologies Showcase 2024 on 8th November in London.
AIKO and ACAP to embark on $4m initiative
AIKO has partnered with the Australian Centre for Advanced Photovoltaics (ACAP) to set on a $4 million research and development initiative focused on enhancing silicon solar cell efficiency using advanced photon multiplication (PM) technology.
Infineon launches new gate driver
Infineon is launching the new MOTIX TLE9189 gate driver IC for safety-critical applications for 12V brushless DC (BLDC) motors.
ABLIC launches the S-821A/1B Series of 1-cell battery protection ICs
ABLIC has launched the S-821A/1B Series of 1-cell battery protection ICs which realise high side protection using Nch MOSFETs.
Series 16 – Episode 6 – Generative AI: an industrial use case
Paige West speaks with Fausto di Segni, European Head IoT & AI, SECO about how integrating Generative AI can further businesses goals.
Sphere celebrates spooky season with Sphere of Fear
Sphere Entertainment Co. announced a custom Halloween Exosphere content show bringing spooky season to theworld’s largest LED screen.
Siemens splashes out $10 billion to buy Altair
Siemens is spending $10.8 billion to acquire software supplier Altair Engineering.
ESCATEC’s UV enhanced die bonder technology
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.