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Infineon introduces its first Qi2 MPP wireless charging transmitter
Infineon has introduced its first Qi2 Magnetic Power Profile (MPP) charging transmitter solution, the reference design kit REF_WLC_TX15W_M1.
Unlocking the mind: Why and how AI can help decode brain activity
Decoding brain activity lies in a fascinating intersection between neuroscience and machine learning (ML).
Arrow Electronics adds Truesense Ultra-Wideband portfolio
Arrow Electronics has announced a global distribution agreement with Truesense, a pioneering company in edge AI, software algorithms, and UltraWideBand (UWB) radar and ranging technology, to distribute Truesense modules, development kits, and software.
TurinTech AI join UbiOps for machine learning code for inference and serving
TurinTech AI has announced its partnership with UbiOps, the ModelOps platform that enables data analytics teams to deploy, serve and scale AI and machine learning workloads, to power the next generation of AI applications.
Siemens simplifies development of AI accelerators
Siemens Digital Industries Software announced Catapult AI NN software for High-Level Synthesis (HLS) of neural network accelerators on Application-Specific Integrated Circuits (ASICs) and System-on-a-chip (SoCs).
Close to the bleeding edge at SM&E Week 2024
Smart Factory Expo, part of Smart Manufacturing & Engineering Week 2024, will host the Made Smarter Innovation Showcase at this year’s event bringing the latest bleeding edge industrial technology to Birmingham’s NEC on the 5th and 6th June.
Avnet launches QCS6490 Vision-AI development kit
The QCS6490 Vision-AI Development Kit from Avnet enables engineering teams to rapidly prototype hardware, application software and AI enablement for multi-camera, high-performance, Edge AI-enabled custom embedded products.
Stanley Electric selects its newest MEMS IC design
Siemens Digital Industries Software has announced that Stanley Electric, a pioneering automotive electronics company, has adopted Siemens’ Questa Advanced Verification platform as the integrated circuit (IC) functional design verification environment for the design of Stanley’s next generation microelectromechanical systems (MEMS) device.
iWave launches the iW-RainboW-G61M modular SoM
iWave has announced the launch of the iW-RainboW-G61M System on Module, powered by NXP Semiconductors i.MX 95 applications processor.
XLR Audio connector range with 10 colour-coded sleeve options
Amphenol distributor Inelco Hunter announces the availability of the AX Series Colour Coded Sleeve System for industry-standard XLR plug and socket connectors.