Search results for "XP Power"

electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.

At this year's electronica, attendees can explore a wide range of onsemi's intelligent power and sensing technologies that address the world's toughest problems, helping to pave the way for a safer, more sustainable, and technologically advanced future.

Infineon is introducing the HybridPACK Drive G2 Fusion, establishing a new power module standard for traction inverters in the e-mobility sector.

Agile Analog has announced a Memorandum of Understanding (MoU) with the Southern Taiwan Industry Promotion Centre.

At the IEEE Wireless Power Technology Conference and Expo (WPTCE) in Kyoto, Japan, Rohde & Schwarz presented a proof of concept for testing far-field wireless power systems.

Google has announced a partnership with Kairos Energy as it turns to nuclear energy to tackle the growing AI data centre power consumption crisis. The partnership will see Google utilise a fleet of Kairos Energy’s advanced small nuclear reactors for its AI data centres, potentially the start of an industry-wide sweep to decarbonise the tech sectors carbon footprint.

KIOXIA Europe has announced the release of its latest KIOXIA XD8 Series PCIe 5.0 Enterprise and Datacentre Standard Form Factor (EDSFF) E1.S SSDs.

Indium Corporation is pleased to announce its participation in the upcoming International Electronics Manufacturing Technology Conference (IEMT), to be held from 16-18 October in Penang, Malaysia.

NXP Semiconductors has unveiled its new S32J series of high-performance Ethernet switches and network controllers.

Farnell has announced the availability of Abracon's new AOTA Series mini-moulded inductors.