Search results for "NXP"
Top 5 communications product stories in November
Electronic Specifier takes a look at the top communictions product stories to have been released in November 2021.
LDRA Assures mission-critical systems
Mission-critical systems powered by NXP S32K3 MCUs, LDRA Helps improve code quality, security while reducing development safety, and certification costs.
Computer-on-Modules meet functional safety and security
congatec has announced its strategic partnership with SYSGO to create Computer-on-Modules meet functional safety and security
Congatec introduces real-time over the air platform
Congatec introduces new platforms and design strategies for 5G connected mobile and stationary devices
3 ways not to screw up an eSIM design
After remaining essentially unchanged for more than 25 years, the Subscriber Identity Modules (SIMs) used to authenticate devices onto cellular networks are undergoing a dramatic transformation, moving from physical hardware to downloadable software – embodied by the concept of eSIMs. Cyril Caillaud, NXP Semiconductors, explains.
SolidRun accelerates V2X infrastructure
SolidRun accelerates V2X infrastructure development with new i.MX8X lite mini-SOM
Top 5 T&M products in October
Electronic Specifier takes a look at the top T&M (test and measurement) products to have been released in October 2021.
Vecow announces its Arm-based IoT system's interoperability with Microsoft cloud services
Vecow has announced that Vecow Arm-based IoT Systems have passed the test for functionality and interoperability with Microsoft's cloud services, including AIC-100 and VIG-100. Vecow has joined the Azure Certified Device program, ensuring that users can have IoT solutions up and running quickly with hardware and software that has been pre-tested and verified to work with Azure IoT.
Wi-Fi module supports IEEE 802.11b/g/n w
In stock now at Mouser Electronics is the high-performanceWi-Fi modulefrom Murata Electronics.
NXP brings GaN to 5G multi-chip modules
NXP Semiconductors has announced a milestone for 5G energy efficiency with the integration of Gallium Nitride (GaN) technology to its multi-chip module platform. Building on the company’s investment in its GaN fab in Arizona, NXP has announced RF solutions for 5G massive MIMO that combine the high efficiency of GaN with the compactness of multi-chip modules.