Search results for "Mexico Technology Award"
Fujitsu and AMD to begin strategic partnership
Fujitsu and AMD have announced that they have signed a memorandum of understanding (MOU) to form a strategic partnership to create computing platforms for AI and high-performance computing (HPC).
EVM in 5G NR: addressing measurement challenges
Error Vector Magnitude (EVM) is a critical metric for assessing signal quality in 5G New Radio (NR) networks. As cellular technology evolves, increasing data throughput has been achieved by combining wider channel bandwidths with higher-order modulation schemes. However, these advancements also bring new challenges in accurately measuring EVM, particularly in 5G NR, where higher modulation orders and wider bandwidths are common.
New spectral camera uses AI to boost farm yields by 20%
A team of EU scientists is developing a new spectral camera that uses photonics to reveal what the eye cannot see.
ABB and Blykalla collaborate on small modular nuclear reactor
ABB and Blykalla have signed a Memorandum of Understanding (MoU) to develop advanced nuclear reactor technology, with the aim of supporting Sweden’s efforts to produce clean and reliable baseload energy.
Innoscience adds new GaN devices to portfolio
Innoscience Technology has expanded its portfolio with two 100V automotive-grade GaN devices.
Florian Wunsch joins UP Catalyst as CCO
UP Catalyst announced that Florian Wunsch will join the company as Chief Commercial Officer (CCO).
Siemens splashes out $10 billion to buy Altair
Siemens is spending $10.8 billion to acquire software supplier Altair Engineering.
KIOXIA begins mass production of embedded flash memory devices
KIOXIA Europe GmbH, announces that it has begun mass production of the industry’s first[1] Universal Flash Storage (UFS)[2] Ver. 4.0 embedded flash memory devices with four-bit-per-cell, quadruple-level cell (QLC) technology.
Perforce’s Helix Core now ISO 26262 certified
Perforce Software, a global provider of enterprise DevOps solutions, has announced its version control platform Helix Core has achieved ISO 26262 Functional Safety Process Certification by internationally-accredited certification body TÜV SÜD.
ESCATEC’s UV enhanced die bonder technology
Electronics Manufacturing Services (EMS) provider, ESCATEC, has successfully integrated a UV light feature to its die bonder, significantly enhancing the precision and efficiency of the micro-assembly processes.