Search results for "vision systems"
New RedCap wireless communications modules from SIMCom
SIMCom has launched a new RedCap (reduced capability) wireless communication module range for cost-conscious IoT applications where full 5G performance is not required.
SYSGO and Klepsydra to advance AI in avionics and space systems
SYSGO, a provider of real-time operating systems (RTOS) and hypervisors, and Klepsydra, a specialist in Artificial Intelligence (AI) software for Edge Computing, announce a technology partnership aimed at bringing AI innovation to the avionics and space embedded markets.
Lauterbach and Kernkonzept present Arm Cortex-R82AE Hypervisor Solution
Lauterbach and Kernkonzept have developed a hypervisor solution for the Arm Cortex-R82AE CPU that gives developers of Software Defined Vehicle (SDV) architectures insight into the full SDV software stack and enables them to start software development before corresponding System-on-a-Chip (SoCs) are available in silicon.
TE Connectivity supports automotive 48V transition
As OEMs add more electrical and electronic content to cars, power loads are increasing, leading to a shift in low voltage architectures. A 48 Volt architecture offers the advantage of delivering the same power as a traditional 12 Volt system but with only a quarter of the current, enabling the use of smaller and lighter wiring which enhances efficiency and reduces overall vehicle weight. TE Connectivity is offering products that are 48V ready to ...
L-com launches line of diffuse photoelectric proximity sensors
L-com has recently begun offering a line of diffuse reflection photoelectric proximity sensors.
RELEC new EIRE300 open frame AC-DC power supply
Relec Electronics has announced the release of the EIRE300 series from Vox Power, a powerful addition to its high efficiency AC-DC power supply range designed to meet the rigorous needs of both medical and industrial applications.
Parker Chromerics releases new thermal gap filler
The Chromerics Division of Parker Hannifin Corporation has released THERM-A-FORM CIP 60, a high-performance cure-in-place material and thermal gap filler that offers 6.0 W/m-K thermal conductivity.
Siemens announces next-gen AI software
Siemens Digital Industries Software recently announced the latest advancement in its electronic systems design portfolio: the next generation release takes an integrated and multidisciplinary approach, combining Xpedition software, Hyperlynx software and PADS Profesional software into a unified user experience.
Novocomms launches Private 5G business to satisfy anticipated UK demand
Novocomms has launched a new division – Novocomms Solutions – to exploit the growing demand for Private 5G solutions in the UK and beyond.
New wearable device stimulates skin
A new type of wearable device, a haptic patch, has been created by a team of engineers at Northwestern University, designed to stimulate skin to deliver a variety of sensations.