Search results for "miniaturisation"

The reed relay company with a focus on miniaturisation and high performance, Pickering Electronics, has added a new 10W-rated reed relay to its successful 4mm2 product family which features devices that occupy a PCB footprint of only four by four millimetres, facilitating the highest packing density currently available.

Designing electronic devices is never easy, as engineering professionals know only too well. Meeting the ambitious project goals almost always means making trade-offs of some description, so as to deal with the conflicting objectives of marketing departments and end customers - who inevitably expect significantly more functionality than the previous generation, while occupying much less board real estate. Guest blog written by Mark Patrick, Mous...

A collaboration has been announced between Murata and Cypress Semiconductor, to develop the Type 1LV (CYW43012) solution, a low power, small form factor WiFi and Bluetooth module. This product improves battery life in wearables, smart home products, and portable audio applications.

AEL Crystals has added SiTime MEMS oscillators to its range. SiTime’s silicon-based MEMS oscillators join AEL’s existing range of products designed for the IoT.The Internet of Things (IoT) brings a new dimension to frequency control, as it uses multiple protocols (Bluetooth, ZigBee, Z-Wave, 6LoWPAN, CSR Mesh / Bluetooth Low Energy (LE), Sigfox and Thread).

At PCIM in Nuremberg, Germany (7th-9th May, 2019), ROHM Semiconductor will showcase power semiconductor solutions focused on E-mobility and power supply applications. Energy savings and reduced system costs in all kinds of systems are heavily influenced by choosing the right power device.

To help the industry better tackle the challenges of technology and manufacturing using adhesives and protective materials, Peter Swanson, Managing Director at adhesives specialist Intertronics, ran a seminar at FAST Live. Swanson offered insights into dispensing technology, process validation and the latest positive displacement and jetting technologies.

To improve the efficiency in modern cars on the way to electromobility and in challenging industrial power conversion applications the power density has to be increased without limitations on performance and reliability. Based on the AT&S ECP (Embedded Components Packaging) technology active and passive components have been integrated into PCBs for low-power designs and are used in volume production meeting high-quality requirements.

Specialist in discretes, logic and MOSFET devices, Nexperia, has announced that over twenty logic types in the company’s space-saving leadless MicroPak packages are now AEC-Q100 qualified. These logic solutions claim to be the smallest devices of their type suitable for automotive applications and Nexperia’s Q100 portfolio exceeds the Automotive Electronics Council’s requirements.

HARTING has developed a number of targeted connectivity solutions for the IIoT world of the Industrial Internet of Things (IIoT).The fourth Industrial Revolution is witnessing the ever-advancing convergence of the physical with the digital world.The drive to generate added value from data acquired from machines has seen a rapid rise in the number of sensors and actuators.

ROHM has recently announced the addition of ten new automotive-grade SiC MOSFETs. The introduction of the SCT3xxxxxHR series allows ROHM to offer a large lineup of AEC-Q101 qualified SiC MOSFETs that provide the high reliability necessary for automotive on board chargers and DC/DC converters.In recent years an increasing number of automotive makers are offering electric vehicles in response to growing environmental awareness and rising fuel costs...