Search results for "microelectronics"
A hybrid 3D printing method for flexible electronics
It is often said that ‘two heads are better than one;’ for the Air Force, leveraging the expertise and insights of academia has led to advances in materials development and processing destined to be a game changer for the future fight.A collaboration between scientists at the Air Force Research Laboratory and Harvard University’s Wyss Institute for Biologically Inspired Engineering has resulted in a new method for digital design...
What's new in the 'World of Sensors'?
Learn what the future of sensors will be at this year’s SDC 2017 Keynote Presentations. This year’s conference will feature five keynote speakers that will be highlighting the essence of sensor technology and their development within Silicon Valley. Take a step into the future to learn how the boundaries of microelectronics will be challenged and what type of new sensors are being required to push them to the next level.
Researchers support DARPA’s “CHIPS” initiative
A team of Georgia Tech researchers is bringing electronic design software and communications expertise to DARPA's new CHIPS initiative, which will enable future generations of integrated circuits to be assembled from plug-and-play modules known as “chiplets.” Reusing blocks of existing microelectronics technology could reduce the need to design complex monolithic chips from scratch for new applications.
Method dramatically reduces energy use in making silicon
A University of Wisconsin–Madison chemistry professor has come up with a new and more sustainable way to make silicon at much lower temperatures for the kind of advanced batteries used in electronics such as phones, cameras and laptop computers.Silicon, one of the most common elements on earth, is generally refined from sand, but it could also be sourced from glass. Silicon production is energy-intensive, requiring a temperature of 1700&ord...
Melexis to play leading role in 2017 ESSDERC and ESSCIRC
Melexis has announced its participation and the prominent role it will be playing in the 47th European Solid-State Device Research Conference (ESSDERC) and the 43rd European Solid-State Circuits Conference (ESSCIRC) at the heart of 'Europe's Silicon Valley' in Leuven, Belgium.The long-running conferences are organised by the world leading research and innovation hub for nanoelectronics, energy and digital technologies, imec, and the University of...
Cicor - your technology partner
The Cicor Group is an internationally positioned electronics service provider. As a complete solutions partner, the company creates innovative products for growth markets together with its customers. In the area of microelectronics, Cicor has the most modern assembly and interconnect technologies, also under cleanroom conditions.
Low noise amplifiers feature noise figure as low as 0.4dB
A product family of low noise amplifiers (LNAs) from WanTcom is available at Richardson RFOPD with full design support capabilities. The family of LNAs feature WanTcom's proprietary low noise amplifier technologies, high frequency microelectronics assembly techniques, and long-standing reputation for high-reliability.
Optical nanosensor uses torque for signal processing
The world of nanosensors may be physically small, but the demand is large and growing, with little sign of slowing. As electronic devices get smaller, their ability to provide precise, chip-based sensing of dynamic physical properties such as motion become challenging to develop.An international group of researchers have put a literal twist on this challenge, demonstrating a new nanoscale optomechanical resonator that can detect torsional motion ...
Extension of the SQ3000 platform unveiled and maximises flexibility
Unveiling the new SQ3000-DD 3D Automated Optical Inspection (AOI) system with two Multi-Reflection Suppression (MRS) Sensors, CyberOptics Corporation will be in booth 1J45 at NEPCON South China, scheduled to take place 29th-31st August, 2017 at the Shenzhen Convention & Exhibition Centre.
LoRaWAN module with 'Best of Both Worlds' capability
The results ofMurata's collaboration with both STMicro and SigFox to port the SigFox stack to co-exist alongside the LoRa stack on Murata’s small form factor Type ABZ LoRaWAN module has been announced. With this feature Murata has extended the module’s capability for providing both LoRa and SigFox capabilities worldwide from a single hardware platform. This approach allows customers to decide which network technology serves the applic...