Search results for "Cincoze Co., Ltd."
High power LEDs can handle the heat
Forge Europa has recently developed a number of standard assemblies using high power LEDs (1W) known as aLED. These aLEDs consist of a high power LED mounted on to a thermally optimised substrate complete with a connector or solder pads. This takes the headaches of thermal design away from the luminaire manufacturer and gives them an easy to use sub-assembly.
Murata announces world's smallest pyroelectric infrared sensor
The latest version of Murata's pyroelectric infrared (PIR) sensor is the world's smallest at just 5.0 x 4.7 x 2.4 mm, enabling the sensor to be used in compact, low profile electronic devices and equipment. The IRS-B210ST01-R1 is also the only surface-mount PIR sensor on the market. It features high sensitivity and signal to noise ratio, excellent stability against temperature changes and white light and enhanced RFI immunity.
Murata launches low cost series of surface mount rotary position sensors aimed at consumer and automotive applications
Murata announced the mass production of the SV03 series of low profile surface mount rotary position sensors. Measuring just 11 x 12 x 2.1 mm and weighing only 0.4 g, these compact sensors are idea for use in a broad range of consumer electronics appliance and are also suited to automotive applications. By detecting the angle of rotation of a switch the sensors provide a cost effective rotary switch and feedback sensor. An example application is ...
Aewin Technologies selects Ramtron’s 4-megabit F-RAM memory for advanced industrial PC-based gaming and gambling solutions
Ramtron International Corporation has announced that Aewin Technologies Co., Ltd., Taiwan’s leading applied industrial computing platform manufacturer, has designed Ramtron’s FM22L16 4-megabit (Mb) nonvolatile F-RAM memory into its Intel-based GA-2000 and AMD-based GA-3000 gaming and high-definition multimedia PC boards. The 4Mb F-RAM — with its fast writes, high endurance, and low power — has replaced battery-backed SRAM (BBSRAM) in Aew...
Ramtron Selects KYEC to Expand Assembly and Test Capacity for F-RAM Products
Ramtron announced that it has selected Taiwan-based King Yuan Electronics Co., LTD (KYEC) to expand the assembly and test capacity for its entire line of F-RAM products. KYEC’s global leadership in semiconductor assembly and test services provides Ramtron with incremental back-end production capabilities to satisfy the growing customer demand for F-RAM products.
Intersil Appoints Masayuki Wajima Vice President, Japan Sales
Intersil Corporation has announced the appointment of Masayuki Wajima to the position of Vice President, Japan Sales. As a 26-year veteran of sales and management for technology companies, Mr. Wajima will be responsible for driving all aspects of Intersil’s success in Japan, including strengthening key customer relationships, rapidly growing revenues, increasing market penetration and expanding Intersil’s brand recognition.
ATE System features fully-integrated JTAG/Boundary Scan
Aeroflex has introduced the 5800 Series multi-configuration, multi-function Automatic Test Equipment (ATE) system with integrated JTAG/boundary scan capabilities. The 5800 Series will feature, as an option, the PXI-based SCANFLEX platform from GOEPEL electronic, a leading vendor of JTAG/boundary scan solutions.
MOSIS adds 0.25 micron SiGe BiCMOS technology multi-project wafer (MPW) fabrication
MOSIS, a provider of low-cost prototyping and small volume production services for custom ASICs, announces availability of the IBM 0.25 micron SiGe BiCMOS 6WL technology. Utilising the service gives ASIC designers access to this advanced technology at less than 10% of the cost of a dedicated wafer run, minimizsing up-front risk and costs. The process is suited to high-performance analogue chip design for consumer wireless applications including ...
Tensilica’s Xtensa Customisable Processor Used in Panasonic Mobile’s Wireless Baseband Processor
Tensilica,® Inc. today announced that Panasonic Mobile Communications Co. Ltd. has licensed the Xtensa® LX2 customisable processor core for a baseband processor integrated circuit for mobile phones. Now Panasonic Mobile will develop several different configurations of the Xtensa processor.
Emergency One puts out the fire with Zuken’s E³.series
Specialist fire rescue and emergency vehicle manufacturer Emergency One UK Ltd has selected Zuken’s E³.series software for its electrical harness design. This will enable the company to produce wire harnesses to standardize and reap the cost and reliability benefits, while also delivering flexibility through modular based customization to aid the manufacturing process and enable straightforward retrofit options.