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Nidec and Renesas Electronics have agreed to join forces on the development of semiconductor solutions for a next-generation E-Axle (X-in-1 system) that integrates an EV drive motor and power electronics for electric vehicles (EVs).

To facilitate the dramatic ramp up of US domestic chip fabrication, advanced inspection technology such as scanning acoustic microscopy is necessary to ensure quality and reliability.

To facilitate the dramatic ramp-up of U.S. domesticsemiconductor fabrication, advanced inspection technology such as scanning acoustic microscopy is necessary to ensure quality and reliability.

A new release of its Double Pulse Test solution (WBG-DPT solution) has been announced by Tektronix.

Electronic Specifier takes a look at the top 5 power products to have been released in May 2023.

Electronic Specifier takes a look at the top 5 micro products to have been released in May 2023.

Samtec has fully released its line of vertical solderless, compression mount connectors that incorporate precision alignment features.

Infineon has introduced its first Qi2 Magnetic Power Profile (MPP) charging transmitter solution, the reference design kit REF_WLC_TX15W_M1.

TE Connectivity will showcase a broad range of high-speed data communications connectivity solutions in booth B26 at the OCP Global Summit Oct 17-19, 2023 at the San Jose Convention Centre.

IQE has announced the launch of a new portfolio of 200mm RGB epitaxial wafer products for microLED display qualification.