Search results for "United Electronic Industries "

COP 28, the 28th annual United Nations (UN) climate meeting that took place in Dubai, has delivered some progress towards addressing the climate crisis.

Fan out wafer level packaging (FOWLP) is an advanced semiconductor technology designed to enhance performance and miniaturise electronic devices.

Indium Corporation experts will share their technical insight and knowledge on a variety of industry-related topics throughout PCIM Europe, June 11-13, in Nuremberg, Germany.

Arrow Electronics has announced an EMEA distribution agreement with The Things Industries, a full-service LoRaWAN (Long Range Wide Area Network) solutions provider.

Students in West Cumbria have been tasked by the Robotics and AI Collaboration (RAICo) and the Industrial Solutions Hub (iSH) to design and build robots which will be showcased at a major robotics and artificial intelligence (RAI) industry event.

Engineers from Princeton and North Carolina State University have crafted a soft robot called the 'Robotapillar' to wiggle past the current limitations of traditional robotics when in tight or dangerous spaces.

Lane Electronics has once again satisfied all the requirements to become fully registered on the JOSCAR (Joint Supply Chain Accreditation Register) accreditation register as set out by the participating buying organisations.

Industry leaders, researchers, and policymakers will gather to discuss the future of light technologies, focusing on technological sovereignty and the necessity for resilient supply chains in Europe, at this year's Photonics Partnership Annual Meeting.

Allstar has announced it is supporting the Scottish government’s EV initiative for an ideal public charging offering.

Keysight’s device security research lab, Riscure Security Solutions, has received formal approval from the Netherlands Vehicle Authority (RDW) to become a designated technical service provider for approval of the United Nations Economic Commission for Europe (UNECE) R155 and R156 regulations.