Search results for "Toshiba"
Stepping motor driver suitable for automotive applications
A new constant current 2-phase stepping motor driver has been launched by Toshiba Electronics Europe for automotive applications and a range of general uses, including adjusting the mirror for projection of heads-up displays, motorcycle valves and valve/damper controllers in HVAC applications.
Transistor arrays deliver 40% power savings
Eleven products have been added toToshiba Electronics Europe's line-up of new-generation transistor arrays equipped with DMOS FET outputs, capable of delivering high-voltage, large-current drive up to 50V/0.5A. The new devices expand the 37 products that are already part of the TBD62xxxA series, which have found wide application in areas including motors, relays, LEDs, and level shifters for control communication lines.
Three-phase brushless motor drivers function in confined spaces
Two new three-phase brushless motor drivers have been launched by ToshibaElectronics Europe. TC78B015FTG is for 12V power supply applications and TC78B015AFTG supports applications using 24V. The new ICs support high-speed rotation of small fan motors and are suited to home appliance and industrial equipment applications.Cooling fans, such as those found in servers, combine minimum size with a high rotation speed thereby ensuring maximum cooling ...
N-channel MOSFET features integrated SRD for power supplies
Toshiba Electronics Europehas expanded its line-up of MOSFETs based on its latest generation U-MOS-IX-H trench semiconductor process with a new, ultra compact 40V device featuring an integrated Soft Recovery Diode (SRD).
Robot helps manufacturers meet time-to-market pressures
Industrial robot distributor, TM Robotics has assisted in the launch of Toshiba Machine’s THE400 SCARA robot, which was unveiled at the International Robot Exhibition (IREX) 2017. The biennial show was held on 29thNovember to 2nd December, at the Tokyo Big Sight in Japan. Alongside the new SCARA model, Toshiba Machine demonstrated its robot programming tool, 3D vision software and models from its 6-axis range.
Observations from the International Robot Exhibition (IREX)
With over 300 exhibitors spread across two halls, the International Robot Exhibition (IREX) is the largest robot trade show in the world. Held at the Tokyo Big Sight in Japan, the biennial event welcomes robot manufacturers from around the globe to introduce the latest robotic technology. Here, Nigel Smith, managing director at Toshiba Machine partner, TM Robotics explains how IREX’s popularity has grown and how the themes at the 2017 show ...
Boldly going where no man can
The 2011 Fukushima nuclear disaster was the most costly nuclear related incident since Chernobyl 25 years earlier. It was caused by a tsunami following the Tohoku earthquake, which disabled the emergency generators that were employed to cool the reactors. This insufficient cooling led to three nuclear meltdowns, hydrogen-air explosions and the release of radioactive materials.
Measures in place to rebuild stakeholder trust
Earlier this year Toshiba Corp agreed to pay $2.168bn to walk away from two unfinished nuclear reactors in South Carolina being built by its Westinghouse subsidiary. Payments will be made in instalments that began in October and will end in September 2022.
Ga-doped Ge source/drain contacts achieve low contact resistivity
At the International Electron Devices Meeting (IEDM), imec reported ultralow contact resistivity of 5x10-10Ωcm2 on Gallium (Ga)-doped p-Germanium (Ge) source/drain contacts. The low contact resistivity and high level of Ga activation were achieved after nanosecond laser activation (NLA) at low thermal budget. The results show that highly Ga-doped Ge-rich source/drain contacts provide a promising route for suppressing parasitic source/drain resi...
Heterogeneous sequential for advanced CMOS nodes
At the 2017 International Electron Devices Meeting (IEDM), imec, research and innovation hub in nano-electronics and digital technology, presented the first Power-Performance-Area-Cost (PPAC) analysis of different sequential 3D-integration variants using advanced 5nm and 3nm CMOS technology nodes.