Search results for "SEMI MEMS"
Nordson Electronics maintains ISO 9001:2015 certification
Nordson Electronics has announced that it has received ISO 9001:2015 Quality Management System certification renewal for its Carlsbad, California, USA facility, effective September 2024 until September 2027.
Cambridge GaN Devices joins G7 and OECD semiconductor events
Cambridge GaN Devices (CGD), the fabless, clean-tech semiconductor company that develops energy-efficient GaN-based power devices that make greener electronics possible, is taking part in two international events aimed at increasing the resilience of the semiconductor value chain and promoting information exchange and closer coordination between governments on semiconductors.
Boosting solar cell efficiency and durability
Researchers at the Hong Kong University of Science and Technology (HKUST) have made significant strides in the development of perovskite solar cells, enhancing both their efficiency and durability through a novel molecular treatment.
SCD unveils Sparrow HD
SCD has introduced its latest innovation: the Sparrow HD detector. This next-generation Mid-Wave Infrared (MWIR)sensor modulehas an industry-first 5-micron pixel pitch, making it the smallest available in the market.
Trusted Connectivity Alliance re-elects Chair
Bertrand Moussel (Valid) has been re-elected as Chair of theTrusted Connectivity Alliance(TCA), while Cyril Caillaud (NXP Semiconductors) has also been re-elected to the rotating Board seat.
AOS releases ideal diode protection switches
Alpha and Omega Semiconductor (AOS) has announced the release of its AOZ1390DI-01 and AOZ1390DI-02 ideal diode protection switches.
ECS 2024 successfully concludes: industry insights and future outlook
On September 19, 2024, the Electronics Component Show (ECS) successfully concluded at Kassam Stadium in Oxford, UK, attracting numerous manufacturers, distributors, engineers, and procurement professionals in the electronic components industry.
Synopsys and TSMC Pave the path for trillion-transistor AI and multi-die chip design
Synopsysannounces its continued, close collaboration with TSMC to deliver advanced EDA and IP solutions on TSMC's most advanced process and 3DFabric technologies to accelerate innovation for AI and multi-die designs.
Preferred Networks adopts Siemens’ software for next-gen AI chip design
Siemens Digital Industries Software announces that Japan-based Preferred Networks (PFN), a pioneer in deep learning and artificial intelligence technology, has selected Siemens’ PowerPro software to optimise the power efficiency of its next-generation AI processors.
Bendable non-silicon RISC-V microprocessor
Qamcom has announced the completion of a joint research project, and the publication of an article titled 'Bendable Non-Silicon RISC-V Microprocessor'.