Search results for "miniaturisation"

ROHM has announced the development of ultra-compact 1.6x1.6mm size MOSFETs that deliver superior mounting reliability. The RV4xxx series is AEC-Q101 qualified, ensuring automotive-grade reliability and performance under extreme conditions. ROHM’s original package processing technology enables the miniaturisation of automotive components, such as ADAS camera modules, that demand high quality.

The HARTING Technology Group have received the German Innovation Award 2019 for their ix Industrial range. The connector impressed the German Design Council and won the award for ‘Excellence in Business to Business’. The German Innovation Award acknowledges products and solutions that set themselves apart from conventional solutions.

The global market for IoT-focused satellite services, focused on end-device connectivity hardware and the annual connectivity fees charged, will grow to $5.9bn in 2025, after taking off in the 2021-2022 period. Incumbent satellite providers will be pressured by a new wave of startups that are leveraging the recent advances in smaller satellite technologies, but many of these new entrants are going to strike out or be absorbed by their larger and ...

The GaN and SiC Power Semiconductor Market is set to grow from its current market value of more than $400m to over $3bn by 2025; as reported in the latest study by Global Market Insights. The power semiconductor devices are witnessing high adoption for different power applications fuelling the growth of the GaN and SiC power semiconductor market.

Wearable technology is set to be the basis for the next digital health revolution. Intelligent and automatic real-time control/monitoring will become the most important paradigm of the medical sector, enabling high degrees of patient care and better quality of life to those suffering with long term illnesses. By Mark Patrick, Mouser Electronics

Rohde & Schwarz is collaborating with COMPRION to supply telecommunication solution providers with a method for testing remote SIM provisioning (RSP) of embedded UICCs (eSIMs) required for Industry 4.0 and connected car applications.

As devices continue to shrink and customers demand ever sleeker products, Maxim Integrated Products, has introduced the MAX98390 smart amplifier with integrated Dynamic Speaker Management (DSM) algorithm to efficiently deliver louder, clearer, richer sound at a low quiescent power.

Nicomatic has launched a new series of 1.00mm pitch connectors for demanding space-constrained applications in harsh environments such as aerospace and industrial equipment. Five standard layouts with six, ten, 20, 34 and 50 contacts distributed over two rows are stocked in depth for immediate shipment.

Renesas Electronics hasintroduced the RX72M Group of RX microcontrollers (MCUs) featuring an EtherCAT slave controller for industrial Ethernet communication. The new flagship product group for the Renesas RX family offers a high performance, single-chip MCU solution with large memory capacities for industrial equipment requiring control and communication functions such as compact industrial robots, programmable logic controllers, remote I/O, and ...

Every computer, audio device, smart phone, digital camera requires plastic housings, circuit boards and wiring to function. And as electrical, communication and information devices shrink and get lighter, so too does the size of the components contained inside. By Nigel Flowers, Managing Director, Sumitomo (SHI) Demag UK