Search results for "direct insight"
New sensor improves robotics
Lumotive and Hokuyo Automatic have announced the commercial release of the YLM-10LX 3D lidar sensor.
Navigating the RISC-V landscape: unveiling the Embeetle IDE
Embeetle was founded by three engineers with unique insights into embedded software IDEs. The Embeetle team is committed to building a healthy MCU ecosystem, offering convenience to manufacturers and developers. The Embeetle IDE addresses one of the main challenges in adopting RISC-V technology: the development environment.
What is a ZimaBoard?
ZimaBoard is a single-board computer designed to serve as a versatile and powerful personal server.
Top 5 IoT products in May
Electronic Specifier takes a look at the top 5 IoT products to have been released in May 2024.
ByteSnap releases AI in electronics survey findings
ByteSnap Design has released the findings of its survey on the impact and perceptions of AI within the electronics industry: entitled AI in Electronics: Balancing Promise and Pragmatism.
Celebrating the success of the 5th Edition Connected Africa Summit
We are thrilled to express our heartfelt appreciation for your unwavering support of the 5th Edition Connected Africa Summit – Africa’s Premier Telecom Summit.
Volvo developing hydrogen-powered trucks
Volvo Trucks is developing trucks equipped with combustion engines that run on hydrogen.
Hardware Pioneers 2024
Collaboration and communication were key themes at the recent Hardware Pioneers event, as the industry faces challenges such as regulatory compliance and issues in cellular IoT connectivity that require close cooperation and information sharing.
Three key components needed to boost performance of next generation EV traction inverters
A traction inverter converts the EV battery’s high-voltage DC to the AC that the electric motor needs. The traction inverter controls the speed and torque of the motor, and its efficiency has a direct impact on the power and thermal dissipation, as well the EV’s driving range.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...