Search results for "SMTA"

Nihon Superior Co. Ltd., will introduce the newest addition to its SN100C lead-free solder series, in Booth #310 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Aqueous Technologies Corp announces that President Mike Konrad will present “Cleaning in a World of ‘No-Clean’” at 7 p.m. at the upcoming SMTA Carolinas Chapter meeting scheduled to take place on Thursday, March 15, 2012 at the Bose Corporation Headquarters in Blythewood, SC.

Aqueous Technologies Corp., will highlight the Trident XLD in Booth #505 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

Kester announces that Peter Biocca, Senior Market Development Engineer, will Co-Chair Session PRC2, titled “Strategies for Optimizing AOI and X-Ray Inspection” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The session will take place Wednesday, October 27, 2010 from 10:30 a.m.-12 p.m. in room Europe 1.

IPC and SMTA jointly announce the agenda for Session 6 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 5 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 7 of the High Performance Cleaning and Coating Conference, scheduled to take place November 16-18, 2010 at the Renaissance Hotel & Convention Center in Schaumburg, Illinois.

MARTIN will demonstrate the Prebump/Reball 03.1 unit at the upcoming SMTA Capital Expo and Tech Forum, scheduled to take place Tuesday, September 21, 2010 at the Johns Hopkins University/Applied Physics Lab in Laurel, MD.

The unit can handle the complete QFN solder bumping process, even for the smallest pitches. Using unique Hotprint Technology, the mask is not removed after printing paste but remains on the QFN during reflow.

SEHO Systems GmbH announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Process Control – Basis for a Cost-Effective Selective Soldering Process” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL. The presentation will be held during the Selective Soldering session, which will take place Wednesday, October 2...