Search results for "Photonic Microsystems"
Yokogawa’s power analysis helps Solar Team Twente get its car to first place in Morocco
Yokogawa announces that its WT5000 Precision Power Analyzer has been used by Solar Team Twente to win the first ever Solar Challenge Morocco.
VCSEL industry: a $3.9BN market driven by consumer and datacom applications
By 2022, the vertical-cavity surface-emitting laser (VCSEL) market has almost doubled compared to 2018, reaching $840m.
Allegro announces position sensors for ADAS applications
Allegro MicroSystems has announced the launch of its A33110 and A33115 magnetic position sensors at the Sensors Converge Conference in San Jose, CA.
Military + Aerospace Electronics Innovators Award-winning die bonder
Palomar Technologies, a global leader in delivering total process solutions for advanced photonics and microelectronic device packaging, announced today that its Palomar 3880-II Die Bonder was recognized among the best by the 2022 Military + Aerospace Electronics Innovators Awards. An esteemed and experienced panel of judges from the aerospace and defense community recognised Palomar Technologies as a Gold honoree.
Fraunhofer IPMS part of project to pave way for quantum computer
Together with 24 German research institutions and companies, the Fraunhofer Institute for Photonic Microsystems IPMS is working on a quantum computer with improved error rates in the collaborative project QSolid coordinated by Forschungszentrum Jülich.
O-band tech to reduce the cost of building 5G networks
Salumanus has reintroduced a complete network solution based on O-band, a type of optical transmission with significant cost saving advantages for 5G networks.After months of testing in a special laboratory in Poland, the GBC Photonics QSFP28 optical modules and multiplexers by Salumanus are now available to order.
Palomar Technologies Places Palomar 9000 Wedge
Palomar Technologies places palomar 9000 wedge bonder with bay photonics for advanced photonics applications.
CEA-Leti & Intel report die-to-wafer self-assembly breakthrough
In a breakthrough for the future of die-to-wafer (D2W) bonding, CEA-Leti and Intel have optimised a hybrid direct-bonding, self-assembly process that has the potential to increase the alignment accuracy as well as fabrication throughput by several thousand dies per hour.
microLEDs deliver new approach to AR glasses
What are said to be the industry’s first microLED devices with integrated micro-lenses for pixel level beam shaping have been unveiled by MICLEDI Microdisplays.
Allegro MicroSystems expands portfolio of gate drivers
Allegro MicroSystems has announced it has expanded its portfolio of three-phase sensorless BLDC gate drivers. Its newest offerings, the A89332 and A89332-1, are designed to meet the evolving needs of cooling systems in today’s data centers offering flexible options for designers.