Search results for "Indium Corporation"

Avalue Technology has announced its participation in Embedded World 2024, taking place from April 9th to 11th in Nuremberg, Germany.

Powercast and Powermat have announced that their wireless power partnership was awarded Sustainability Initiative of the Year in Business Intelligence Group's 2023 Sustainability Awards programme, for the companies' joint efforts to promote sustainability through wireless power.

Winbond Electronics, a global supplier of semiconductor memory solutions, and Mobiveil, a fast-growing supplier of Silicon Intellectual Property (SIP), platforms, and IP-enabled design services, have announced a collaboration on a new IP controller targeting various applications such as automotive, smart IoT, industrial, wearables, TWS, wireless headsets, smart speakers, and connectivity.

Semtech a high-performance semiconductor, IoT systems, and cloud connectivity service provider, andOxit, a pioneering company focusing on innovation in Internet of Things (IoT) services, have announced a collaboration to enable device manufacturers to build a single device with theOxTech Multi-Connectivity Modulethat can connect to both AWS IoT Core for Amazon Sidewalk and AWS IoT Core for LoRaWAN networks in the US, as well as to any LoRaWAN net...

KYZEN will exhibit at the SMTA Long Island Expo and Tech Forum, scheduled to take place Wednesday, September 13th, 2023 at the Marriott Melville Long Island in Melville, New York. The KYZEN clean team will focus on both AQUANOX A4626 and the KYZEN Process Control System (PSC) during the event.

Engineers at the University of California San Diego have crafted an ultra-sensitive sensor from graphene capable of detecting lead ions at concentrations previously undetectable by current technologies.

Siemens Digital Industries Software has announced that South Korea-based nepes corporation, which delivers Outsourced Semiconductor Assembly and Test (OSAT) services, has leveraged a range of solutions from Siemens EDA to tackle the broad range of complex thermal, mechanical, and other IC packaging design challenges associated with developing advanced 3D IC packages.

Distributor Richardson RFPD is shipping two families of low-pass filters from CTS Corporation.

TAITRA (Taiwan External Trade Development Council) has announced Pat Gelsinger, CEO of Intel Corporation, as a keynote speaker at COMPUTEX 2024 on June 4.

SEGGER announces that its J-Link debug probes now support the new RZ/V2H MPU from Renesas Electronics Corporation.