Search results for "RECOM"
Foiled aluminum for printed circuit board production
Recently NEON-EK stock has been supplied with foiled aluminum from Politronics Technology Corporation. It is used for printed circuit board production. The insulator is made of unique polymer composite, which combines an epoxy resin and high thermal conductivity filler. The thermal conductivity of such material is about 20 times higher than conventional epoxy system filled with glass fiber.
Cobar Solder Products to Introduce SELective Soldering Package at SMTAI 2011
The Balver Zinn Group announces that Cobar Solder Products Inc. will introduce a complete SELective soldering package in Booth #314 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.
Techcon Systems Enhances the TS6500CIM Techkit Mixer
Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces the updated TS6500CIM Techkit Mixer. Following positive feedback received from world-leading aerospace manufacturers, Techcon Systems has further enhanced the mixer, meeting and exceeding recommendations, while still maintaining the low cost of its predecessors
Pricing pressures is one of the main concerns for EU companies!
In today’s global economy, organisations are facing unprecedented pricing pressures as they deal with volatility in the commodities markets, currency fluctuations and unyielding international competition. To help mitigate the challenges, a number of world-class companies are turning to pricing software recommended by organisations from McKinsey, to Gartner and KPMG. In fact, both McKinsey and Gartner indicate that raising prices by 1-2% reaps m...
Prism Sound Announces a Webinar on Digital To Analogue Converter Evaluation
Prism Sound is hosting an educational webinar on March 14th to discuss the theory and practice of evaluating digital-to-analogue-converter (DAC) performance in audio applications.
Microsemi Corporation Announces Successful Completion of Acquisition of Zarlink Semiconductor Inc.; Offers Extended to Facilitate Acquisition of Untendered Securities
Microsemi Corporation and Zarlink Semiconductor Inc has announced that 0916753 B.C. ULC, an indirect wholly-owned subsidiary of Microsemi, has accepted the tender of and will acquire today 123,438,737 Zarlink shares, representing approximately 96 percent of Zarlink's outstanding shares, and CAD$54,417,000 principal amount of Zarlink convertible debentures, representing approximately 87 percent of Zarlink's outstanding debentures.
Freescale announces RF power LDMOS transistors that cover full frequency bands for wireless base stations
High efficiency and wide instantaneous bandwidth allow network operators to reduce operating and capital expenditures and improve network flexibility
UL and ITI Help Chinese Manufacturers Prepare for the Innovative Hazard-based Safety Standard IEC62368-1
Underwriters Laboratories and U.S. Information Technology Industry Council (ITI) presented a seminar that introduces the new international standard IEC62368-1 to suppliers of ITE and A/V products, which helps Chinese manufacturers understand and prepare for the transition to this new hazard-based safety standard.
HUBER+SUHNER - High density fibre connectivity for the evolving SAN network
Connectivity specialist HUBER+SUHNER has now incorporated ‘plug & play’ MTP connectivity to its class-leading LiSA Fibre Management System. The MTP 12 fibre and 24 fibre connectors allow high-density connections within the same footprint as a standard SC connector and can reduce installation and servicing times by up to 75%.
ESSEMTEC to Demonstrate Solutions for the Entire Production Process at the 2012 IPC APEX Expo
Essemtec announces that it will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.