Search results for "spectrum analysis"

NordsonTEST & INSPECTION announced its participation in SEMICON Taiwan, one of the most anticipated events in the semiconductor industry.

Kongsberg Discovery is pleased to announce a significant milestone in the development of its AUV HUGIN Endurance, following a record-setting, fully autonomous multi-week mission.

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.

Small and mid-sized electronics manufacturers in the UK are facing a ‘silent killer’ as new figures show profitability has dropped, despite strong sales.

Newpatent datareveals the UK ranks 8th globallyin AI innovation, trailing behind global leaders, indicating that more needs to be done by the UK government to close the gap and be among the major nations for AI innovation.

RECOM’s portfolio of products and capabilities is now significantly enhanced with the acquisition of LECO.

Nordic Semiconductorhas confirmed that its upcoming nRF54L and nRF54H Series Systems-on-Chip (SoCs) will support Channel Sounding, a key feature in the newly adopted Bluetooth 6.0 specification.

PCIM Asia2024, Asia’s leading international platform for communication and exchange in power electronics, intelligent motion, renewable energy and energy management, concluded on 30th August 2024 at the Shenzhen World Exhibition and Convention Centre in China.

KYZEN has announced its strategic partnership with the tool distributor ADTOOL Corporation.

SEC Glasgow to welcome global leaders to explore new frontiers at the biggest space industry event ever held in Scotland, 11 – 12 September.