Search results for "module"

Authorised distributor Mouser Electronics is now stocking the XPLR-IOT-1 Explorer kit from u-blox.

Electronic Specifier takes a look at the top 5 IoT products to have been released in May 2024.

Infineon is on schedule with the construction of the Smart Power Fab in Dresden and is initiating the final construction phase.

MIKROE has launched 4G LTE&GNSS Click, a compact add-on board designed for advanced global tracking and telematics applications, enabling developers to build highly efficient and smaller solutions without compromising performance.

STMicroelectronics announces a new high-volume 200mm silicon carbide manufacturing facility for power devices and modules, as well as test and packaging, to be built in Catania, Italy.

Microchip Technology has expanded its Bluetooth Low Energy portfolio with 12 new products, aimed at providing designers with an extensive array of choices to tackle their unique challenges, effectively lowering barriers across designs spanning from the simplest to the most advanced.

iWave introduces iW-RainboW-G63M: a System on Module (SoM) based on the AMD series, targeting next-generation network and cloud deployments.

COPA-DATA, the developer of industrial automation software zenon, has announced the release of zenon 14.

WeEn Semiconductors will be exhibiting the company’s latest highly efficient, high-power density silicon carbide (SiC) technologies, automotive grade power devices and highly reliable IGBTs at PCIM Europe 2024 in Nuremberg from June 11-13, 2024.

ITEC has introduced the ADAT3 XF TwinRevolve flip-chip die bonder, which runs five times faster than existing machines, attaching up to 60,000 flip-chip dies per hour.