Search results for "electronica 2024"
Infineon announces next generation CoolGaN transistor families
Infineon has announced two new generations of high voltage (HV) and medium voltage (MV) CoolGaN devices which now enable customers to use Gallium Nitride (GaN) in voltage classes from 40V to 700V in a broader array of applications that help drive digitalisation and decarbonisation.
Imec demonstrates new die-to-wafer hybrid bonding
At IEEE ECTC 2024, imec presented a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such fine-grained die-to-wafer interconnects pave the way to logic/memory-on-logic and memory-on-memory applications. On the longer term, die-to-wafer bonding will enable also die- and wafer-level optical interconnects – for whi...
Toshiba sustainability focus at PCIM 2024
Toshiba will bring solutions that support customers’ goals in reducing their CO2 footprint at the PCIM 2024 conference and exhibition (Nuremberg 11th – 13th June).
WeEn Semiconductors at PCIM Europe 2024
WeEn Semiconductors will be exhibiting the company’s latest highly efficient, high-power density silicon carbide (SiC) technologies, automotive grade power devices and highly reliable IGBTs at PCIM Europe 2024 in Nuremberg from June 11-13, 2024.
What is being developed with quantum computers today?
The risk of missing out on the competitive advantage quantum computing offers is rising. Governments and private investors worldwide are placing multi-billion-dollar bets that the industry will produce huge long-term returns. Yet, for this to be realised, the theoretical advantage of quantum computers must be translated into real-world commercial value. In this article,IDTechEx explores which applications are being developed across the materials,...
Advantech wins 2024 VDC Research Embeddy Hardware award
Advantech has been awarded the 2024 Embeddy Hardware Award from VDC Research for its ROM-2860.
Infineon drives decarbonisation and digitalisation for a greener future
At PCIM Europe 2024, Infineon Technologies will showcase its latest semiconductor, software, and tooling solutions addressing today’s green and digital transformation challenges.
Infineon unveils CoolSiC MOSFETs 400V
With the increasing power requirements of artificial intelligence (AI) processors, server power supplies (PSUs) must deliver power without exceeding the defined dimensions of the server racks.
maxon’s UK Drive Technology Insight
maxon UK & Ireland’s Drive Technology Insight 2024 event attracted over 100 design engineers to the Williams F1 Conference Centre last week for a day of DC motor technology presentations and engineering discussion.
Danisense to exhibit at PCIM 2024
Danisense will be exhibiting at PCIM 2024 in Nuremberg from 11th to 13th June 2024 at the stand of its German distribution partner ZES Zimmer in Hall 9 Booth 320.