Search results for "miniaturisation"

The market for industrial-use elastomers is defined by extremes. Whether chemical compatibility, plasma resistance, high and low temperatures, or other characteristics, engineers demand the highest possible performance. By Dr Thomas Reger, Senior Scientist at Greene, Tweed

Lattice Semiconductor has announced an FPGA developed on its new Lattice Nexus FPGA platform, CrossLink-NX. This new FPGA provides the low power, small form factor, reliability, and performance that developers need to create innovative embedded vision and AI solutions for communications, compute, industrial, automotive, and consumer systems.

With the rapid rise of automotive electronics, industrial 4.0, and smart home applications, new IoT edge devices and human-machine interface devices will require new functionality in terms of size, power consumption, and performance. In view of this, many MCU suppliers are developing new-generation MCUs with higher performance and lower power consumption to meet the market demand.

ams has announced the successful completion of the Highly Integrated Optical Sensors Project. The €4.3 million HIOS project aims to enable ams and its consortium partners, the process and equipment suppliers APC, Boschman and Bühler Leybold Optics, to stay at the forefront of sensor integration and drive competitiveness in their respective markets.

embedded world is progressing well, already, the exhibition space booked in 2019 has been exceeded. And the prospects for the embedded world and electronic displays conferences are equally good; the conference programmes are already online. The theme of this year’s embedded world conference – ‘Connecting Embedded Intelligence’ – means that the conference is putting the spotlight on one of the key issues for the secto...

Wearable electronics, such as medical devices and fitness trackers, are going through a period of rapid change. The revolution in ‘personal electronic devices’ is improving the ability of individuals and healthcare professionals to monitor and manage their health. Graeme Clark, Principle Engineer, Renesas Electronics, explains.

In today’s world, where devices and equipment are being designed smaller and smarter and for applications requiring precise rotary and linear measurement, there is an increased demand for digitization and miniaturisation in sensors. To meet this demand, TE Connectivity (TE) has introduced the KMA36 Magnetic Encoder IC.

The latest addition to Link Microtek’s comprehensive range of microwave rotary joints is the AMCORJD-2KU device, which offers a coaxial dual-channel Ku-band capability that makes it well suited for both satellite-on-the-move and radar applications, either military or commercial.

Nano Dimension has announced that it has developed 3D printed capacitors with the Company’s DragonFly additive manufacturing system. These capacitors are embedded in the body of the additively manufactured printed circuit boards (PCBs), saving space and eliminating the need for assemblyc

KEMET has announced a complete capacitance and voltage offering for the KC-LINKTM ceramic surface mount capacitors in the EIA 3640 case size. The very high ripple current capabilities make KC-LINK capacitors well suited for use with fast-switching wide bandgap (WBG) semiconductors.