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UDDC: seamless transmission of image data to microdisplays
Researchers at the Fraunhofer Institute for Photonic Microsystems IPMS have developed a Universal Display Data Converter (UDDC). This enables the transfer of image data to existing Fraunhofer microdisplays from various input interfaces.
Optalysys partners with Google HEIR to trial photonic computing tech
Optalysys, a company enabling the future of secure computing, has partnered with Google HEIR to integrate its photonic processing technology into HEIR’s compiler toolchain for Fully Homomorphic Encryption (FHE).
Q-Tech launches crystal oscillators for space
Q-Tech Corporation has introduced the industry’s first multiple-output temperature-controlled crystal oscillators (TCXOs) designed for full space applications.
Precision labs series: Microcontrollers (MCUs) by Texas Instruments
TI Precision Labs: MCUs isand online classroom for all engineers needing to work with microcontrollers (MCUs). The on-demand curriculum pairs theory and applied lab exercises to deepen the technical expertise of experienced engineers and accelerate the development of those early in their career.
SCS exhibits advanced coating and conveyor systems at The ASSEMBLY Show
Specialty Coating Systems (SCS)announces its participation in The ASSEMBLY Show 2024, taking place 22–24 October 2024, at the Donald E. Stephens Convention Centre in Rosemont, Illinois.
Supermicro launches servers with AMD EPYC 9005 and Instinct MI325X for AI data centres
Supermicro announces the launch of a new series of servers, GPU-accelerated systems, and storage servers featuring the AMD EPYC 9005 Series processors and AMD Instinct MI325X GPUs.The new H14 product line represents one of the most extensive server families in the industry, including Supermicro’s Hyper systems, the Twin multi-node servers, and AI inferencing GPU systems, all available with air or liquid cooling options.
Keysight releases benchtop system for AI and data centres
Keysight Technologies introduces theInterconnect and Network Performance Tester 800GE Benchtop, a new multiport, multi-user, and multi-speed portable design and validation platform that tests artificial intelligence (AI), high-performance computing (HPC), data centre interconnects (DCI), and network infrastructure.
Pickering Celebrates 25 Years in PXI
25 years ago, we created our initial three PXI modules, marking a significant milestone in our journey. These products are still part of our over 200 PXI product families, with over 3,500 PXI and PXIe modules available to order today, a testament to our dedication to customer satisfaction. We will continue designing new PXI modules to address our customers’ varied needs.
Bota Systems’ new sensor optimises Cobots for heavy payloads
Bota Systems, a pioneer in multi-axis force-torque sensors, has launched the SensONE T80, specifically designed for larger cobots. Featuring ISO-standard flanges on both sides, the sensor simplifies integration and ensures superior accuracy even with heavier payloads.
Innovative bonding technologies for AI and electromobility
electronica 2024, one of the world’s most important trade fairs for electronics being held from 12–15 November 2024, will once again bring leading experts, users, and manufacturers to Munich. ASMPT will present its latest technical innovations in the field of bonding for co-packaged optics components and power modules in Hall C3, Booth 300.