Search results for "laser components"
CTX Thermal Solutions at electronica 2024
CTX Thermal Solutions will present its broad portfolio of solutions for efficient thermal management at electronica in Munich from November 12 to 15, 2024.
Gluespec announce new engineering resources
Gluespec has announced new resources for engineers looking for advanced materials.
Anglia and Digi partner for SoM webinar
A webinar introducing Digi’s versatile, secure, wireless System-on-Module (SoM) will be aired on October 22 at 11am BST.
Controlling molecular electronics with rigid, ladder-like molecules
As electronic devices continue to shrink, the limitations of physical size are increasingly hindering the ability to double transistor density on silicon microchips every two years, a trend known asMoore’s law.
Rohde & Schwarz test solutions at CETEX 2024
Rohde & Schwarz will exhibit its advanced test and measurement solutions that address the latest emerging challenges in consumer electronics development at CETEX 2024 in Amsterdam.
A future-proof solution for MicroLED production
Excimer-based laser-induced forward transfer (LIFT) is a practical mass transfer process for today and tomorrow.
Stratasys introduces a new era of 3D printed fashion
Stratasyshas announced the launch of its TechStyle Fabric Alignment Station, the next milestone in the evolution of Stratasys 3DFashion technology.
Advantech launches Edge service packages
Advantech has announced Edge Service Packages, including Azure IoT Edge and AWS IoT Greengrass.
Industrias Alegre and TactoTek announce partnership
Industrias Alegre has signed a collaboration agreement with TactoTek.The collaboration will involve the development of innovative human-machine interface (HMI) solutions that can be integrated into applications for different markets, especially automotive.
Eggtronic launches board for efficient wireless power transfer
Eggtronichas unveiled a newevaluation boardthat allows engineers to quickly develop and prototype ultra-efficient, low-component count wireless power transfer designs for low-power applications.