Search results for "Photonic Microsystems"

Anritsu Corporation and CIG Photonics are jointly demonstrating an 800G optical transceiver PAM4 test solution in the Anritsu Booth (#7B33) at CIOE 2022 to be held from December 7th to 9th, 2022 in the World Exhibition and Convention Centre, Shenzhen, China.

Printed circuit boards (PCBs) are the powerhouse of modern electronics, but increasing demand and design complexity in ever-expanding applications have created novel challenges for manufacturers. This piece from PI (Physik Instrumente) discusses some of the major solutions available.

TechWorks is an industry association at the core of the UK DeepTech community with an ambition to harness the country’s fantastic engineering and innovation credentials as many UKcompanies are leading the way in helping solve global problems such as climate change, food shortages, cancer research and alternative energy.

On October 5 and 6, about 45 industry and research representatives met at LASER COMPONENTS’ premises in Olching near Munich for the 3rd International UV WORKshop.

Consumer biometrics is boosted by SWIR (sensing in the shortwave infrared), under-display face recognition, and optical TFT for full-screen fingerprint sensing.

LASER COMPONENTS supplies iXblue’s space grade optical components, with a history of successful missions using “flight proven” components such as: optical LiNbO3modulators, radiation hardened (rad-hard) fibres and their matching fibre Bragg gratings (FBGs), fibre sources, low noise optical amplifiers, multiplexer/demultiplexer and other micro-optics assemblies for the receiver. We can also provide fully integrated optical transc...

Spintronic devicesare based on using the fundamental spin of electrons to carry and store information. Their use would not require charge currents for their operation and would lead to improved energy efficiency with lower power consumption, higher data processing speed and better integration of memory and logic. However, suitable materials for new spintronic implementations are needed.

Image sensors measure light intensity, but angle, spectrum, and other aspects of light must also be extracted to significantly advance machine vision.

Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the US government and European Commission are gathering in Washington, D.C. this week to discuss ‘the next big thing’ in CHIPS Act implementation: expanding ‘advanced packaging’ capacities and capabilities to go along with expanding production of semiconductor chips.

EssilorLuxottica and Politecnico di Milano have created the first ever joint research centre aimed at designing the smart glasses of the future, EssilorLuxottica Smart Eyewear Lab.