Search results for "matter"

With their new BFS 33M color sensor Balluff introduces a true-color sensor of the highest class. No matter what kind of objects you show the sensor, it can discriminate them all with unerring accuracy. Even the slightest shades, smallest gray level differences or minimal changes to the surface properties are detected without effort.

Laird Technologies announced that one of its subject matter experts, Vice President of Technology for the Laird Performance Materials Division, Dr. Richard Hill, will make a presentation at the PURE Lighting Technology Symposium hosted by Digi-Key.

Laird Technologies, Inc., a global leader in the design and supply of customized performance-critical components and systems for advanced electronics and wireless products, today announced that one of its subject matter experts, Laird Technologies’ Product Director for Thermal Management - Asia, Vincent Tan, will make a presentation at the AMD Technical Forum & Exhibition 2010. The technical forum & exhibition is being held at the NTUH Internat...

Eurotech announced an agreement with NVIDIA to expand the Eurotech Aurora supercomputer product line with new energy-efficient, high-performance GPU-accelerated systems. The agreement builds upon an existing relationship with NVIDIA, that has enabled Eurotech to develop and deliver a number of custom GPU-based solutions to HPC customers throughout Europe.

Eurotech announces a co-design agreement with CINECA for the development and installation of a HPC (High Performance Computer) prototype called Eurora, in a project co-founded by PRACE 2IP. Eurotech received an order assignment of 850 thousand euro to delivery within year-end the first release of the new prototype HPC system. CIN

Solid State Supplies has signed a distribution agreement with Energy Micro, supplier of the world's lowest power microcontrollers. Solid State Supplies will distribute Energy Micro's EFM32 microcontrollers in the UK from September 1st. The EFM32 is the first 32-bit ARM Cortex-M3 product that addresses the low power mixed-signal microcontroller market and is ideal for ultra-low power and battery operated applications.

A new method of heatsinking has been developed by Ohmite which is proving popular with design engineers because it solves the problem creating a gap if the screw is overtightened when installing conventional TO-220 resistors and creates optimal thermal transfer between the resistor (or semiconductor) and the heatsink.

Selecting the best multilayer chip capacitor (MLCC) for the application can involve difficult trade offs involving stability, capacitance and cost. European passive component manufacturer, Syfer Technology, has introduced a range of devices that increases the choice and reduces compromise.

Building on its market leadership in residential femtocells, Picochip is extending its technology into the more traditional part of the public network, adding support for Iub network architectures to its recently-launched picoXcell(tm) PC333 HSPA+ device, and announcing plans for an optimized dual-mode LTE/HSPA+ basestation.

Ramtron International has announced that Blue Planet Co. Ltd., a leading Korean supplier of retrofit diesel particulate filter (DPF) systems and diagnostic modules, has designed Ramtron’s FM3130 and FM3104 Processor Companions into its DMS-series retrofit DPF data loggers.