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Siemens Digital Industries Software announced that its continued partnership with Intel Foundry has led to the creation of a new Electronic Design Automation (EDA) product certification and anadvance in embedded multi-die interconnect bridge (EMIB) technology.

Ceva, the pioneering licensor of silicon and software IP that enables Smart Edge devices to connect, sense, and infer data more reliably and efficiently, announces that it has extended its Ceva-NeuPro family ofEdge AINPUs with the introduction ofCeva-NeuPro-NanoNPUs.

At the PCIM Europe event in Nuremberg, ASMPT showcased a comprehensive power module manufacturing solution.

CEA-Leti is delighted to announce the inaugural meeting today of the FAMES Pilot Line, a project designed to propel semiconductor technologies in Europe forward.

Siemens Digital Industries Software has announced the release of the Solido Simulation Suite software ("Solido Sim" software), an integrated suite of AI-enhanced SPICE, Fast SPICE, and mixed-signal simulators.

Heraeus Electronics is pleased to announce its involvement in the FastLane project, a forward-thinking EU-funded initiative dedicated to transforming the European value chain for Silicon Carbide (SiC)-based power electronics.

Alphawave Semi has unveiled a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform.

Alphawave Semi, a global pioneer in high-speed connectivity and compute silicon for the world’s technology infrastructure, has announced a 9.2Gbps HBM3E sub-system (PHY + Controller IP) silicon platform.

Authorised distributor Mouser Electronics is now shipping the CoolSiC G2MOSFETs from Infineon Technologies.

Alphawave Semi has unveiled a 9.2 Gbps HBM3E sub-system (PHY + Controller IP) silicon platform.