Search results for "ai edge computing"

DFI will showcase its latest compact and fan-less industrial PCs with AI acceleration modules at embedded world 2024.

Wire bonding is a key process in semiconductor production. Extremely fine wires with diameters of 15 to 75 micrometres are used to create tinyelectrical connectionsbetween a semiconductor chip and other components.

The rapid rise of data-intensive technologies, such as generative AI (GenAI), presents a serious challenge to decarbonisation efforts unless businesses assume greater responsibility for their Cloud and data practices, according to a report from SAS.

Astute Systems is thrilled to announce the launch of its GXA-1 AI computer, powered by NVIDIA, set to debut in Europe in September 2024. Designed for advanced autonomy, the GXA-1 targets industries requiring high-speed, real-time edge processing, such as agriculture, construction, power sectors (including wind farms, oil and gas pipelines, solar technology), mining, shipping, logistics, and border security.

ADLINK Technology is set to unveil its latest railway technology innovations at InnoTrans 2024.

Advantech has unveiled OM-2860, the latest breakthrough in the Size-L lineup of Open Standard Modules (OSM)—a miniature solder-on module.

Infineon has announced that its new PSOC Edge E8x MCU product family has been designed to meet the highest certification level provided by the PSA Certified program, a framework for embedded security.

With embedded security considered to be a vital aspect in deployment of Internet of Things (IoT) applications, Infineon Technologies says that its new PSOC Edge E8x MCU product family has been designed to meet the highest certification level provided by the Platform Security Architecture (PSA) Certified program, a framework for embedded security.

Here, you’ll find a selection of the latest news, products, and articles from Texas Instruments focused on Processes.

Silicon Labs has announced its new xG26 family of Wireless SoCs and MCUs for IoT applications.