Search results for "Mexico Technology Award"
STMicroelectronics’ STGAP3S advanced galvanically isolated gate drivers
STMicroelectronics’ STGAP3S family of gate drivers for silicon-carbide (SiC) and IGBT power switches combines ST’s latest robust galvanic isolation technology with optimised desaturation protection and flexible Miller-clamp architecture.
Toshiba focuses on e-mobility and energy at electronica
Toshiba Electronics Europe will be showcasing the synergies of its semiconductor, battery, data storage and ceramic substrate products at electronica 2024.
Siemens introduces DFT solution
Siemens Digital Industries Software introduced Tessent Inn-System Test software, a design-for-test (DFT) solution that enhances in-system test capabilities for integrated circuits (ICs).
Series 16 – Episode 8 – AI at the Edge: memory’s role in a data-driven future
Paige West speaks with Axel Stoermann, VP & Chief Technology Officer, KIOXIA Europe aboutAI and Edge computing.
Supporting heavy-duty electric vehicle production through a modular approach
Electrification within urban fleets of public transport continues to grow all over the world. Initially starting in China, while it may have taken a few years for other regions to start their own transitions, we are now seeing progress across a number of different countries and regions.
Surface Mount Technology best practice guide
Advanced Rework Technology (A.R.T.) has produced a best practice guide to Surface Mount Technology (SMT) that provides insights and practical advice to help optimise the assembly line.
Angled M12 SMT ruggedised connectors: small PCB footprint and high reliability
Provertha is expanding its circularconnector portfoliowith the new angledM12 Ruggedised connector series in straight and angled versions for PCB mounting using SMT connection technology (Surface Mounting Technology).
Hitachi High-Tech and University of Tokyo joint Laser-PEEM research
Hitachi High-Tech and The University of Tokyo (UTokyo) have been conducting joint research into practical applications of high-resolution Laser-PEEM developed by UTokyo in the semiconductor manufacturing process.
Reveal at Electronica: new multi-radio Virtual Antenna® component
Ignion will present the latest addition to its portfolio: a multi-radio solution engineered to redefine RFconnectivity and simplify antenna integration. Visit Ignion’s experts at Electronica (booth B4.505) to learn more about this groundbreaking component and see how Virtual Antenna® technology accelerates IoT innovation.
Printed electronics for digitalisation
LOPEC, the trade fair and conference forflexible, organic and printed electronics, will be opening its doors again in Munich from February 25 to 27, 2025.