Search results for "Infineon"

Infineon Technologies has finished its 23rd Annual General Meeting. The entire event was held in a virtual format and broadcast publicly on the company web site. Shareholders had the opportunity to speak live during the event and ask questions.

German President Frank-Walter Steinmeier visited Infineon Technologies in Kulim, Malaysia, as part of his trip to Asia. The visit focused on Infineon's contribution to enabling the global energy transition with energy-saving semiconductor solutions, as well as by investing in solutions that further reduce the CO2footprint in its chip manufacturing.

New automotive-qualified hardware from Rutronik System Solutions: With the RDK4, Rutronik expands its portfolio of base and adapter boards.

Infineon Technologies AG is starting construction of its new plant for analogue/mixed-signal technologies and power semiconductors. After extensive analysis, the Infineon Management Board and supervisory bodies gave the green light for the Dresden site. The German Federal Ministry for Economic Affairs and Climate Action has approved an early project launch, meaning that construction can already begin before completion of the inspection of legal s...

MIKROE, the embedded solutions company that provides innovative hardware and software products, has announced that 500 development boards incorporating the mikroBUS socket are now available from top semiconductor makers.

Arm has unveiled the Arm Ethos-U85, its highest performance, most efficient Ethos NPU to date at embedded world in Nuremberg (April 9-11).

PSA Certified, the global security and evaluation framework for the connected device ecosystem, has announced its highest certification level to date as it accelerates its mission to build assurance in connected devices.

NXP Semiconductors has announced it is strengthening its European research and development (R&D) through grants to be provided via the 2nd Important Project of Common European Interest on Microelectronics and Communication Technologies (IPCEI ME/CT), with the final investment decision pending confirmation of the level of public funding.

Innoscience welcomes two decisions, from March 20, 2024, by the United States Patent and Trademark Office (USPTO) to institute review of the validity of the two remaining US patents, as asserted by Efficient Power Conversion Corporation (EPC) against Innoscience.

The trends toward higher power density and cost optimisation dominate the development goals of efficient high-power applications that create substantial value for segments such as electromobility. To push these boundaries, Infineon Technologies today announced it has successfully registered its QDPAK and DDPAK top-side cooling (TSC) packages, which are ideal for high-voltage MOSFETs as a JEDEC standard.