Search results for "Cincoze Co., Ltd."
Graphjet Technology agreement with Quantum Science for nanomaterials and quantum dot tech
Graphene and graphite producer Graphjet Technology has announced a new partnership with UK headquartered Quantum Science Ltd. that will enhance both companies’ innovation pipelines.
UV experts exchange ideas and experiences at International UV WORKshop
On October 5 and 6, about 45 industry and research representatives met at LASER COMPONENTS’ premises in Olching near Munich for the 3rd International UV WORKshop.
Macronix octaflash UW series memory provides flash solutions for NXP S32Z & S32E real-time processors
Macronix International has announced that Macronix’s MX25UW high efficiency octaflash flash memory family has been selected for NXP Semiconductor’s S32Z and S32E real-time processors for safe integration of real-time applications.
Infinite Electronics completes acquisition of CCG
Infinite Electronics, a global portfolio of in-stock connectivity solution brands, has announced that it has completed the acquisition of Cable Connectivity Group (CCG) from Torqx Capital Partners and TKH Group NV.
FLEXPOINT MVpulse
Housing the highest light intensity is fundamental in machine vision applications.However, when using laser light, the laser class regulations can sometimes be a limiting factor.
LASER COMPONENTS features high luminance white light module & pulsed CW laser module
At VISION 2022 in Stuttgart, Germany, LASER COMPONENTS will present innovations from its laser modules and filter departments.
Vecow and MediaTek collaborate to accelerate next-gen AIoT deployments
Vecow Co., a team of embedded experts, and MediaTek, a global fabless semiconductor and in systems-on-chip for mobile device, home entertainment, connectivity and IoT products, has announced their collaboration to accelerate innovation, and empower the IoT devices to market faster.
Delivery reliability and series production for laser optics with complex specifications
LASER COMPONENTS continues to expand its optics production with two coating systems.
CHIPS Act implementation requires strong focus on 'Advanced Packaging'
Leaders of top semiconductor, microelectronic, IC-Substrate, PCB, EMS, and OSAT companies along with the US government and European Commission are gathering in Washington, D.C. this week to discuss ‘the next big thing’ in CHIPS Act implementation: expanding ‘advanced packaging’ capacities and capabilities to go along with expanding production of semiconductor chips.
More accessories for OKW’s SMART-CASE IP 65 Handheld Enclosures
OKW’s bestselling handheld enclosure SMART-CASE now offers more accessories than any of the manufacturer’s other 18 ultra-portable housings.