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Kontron KISS 4U KTC-5520 Transportation — a powerful passenger infotainment server
Kontron has developed its new KISS 4U KTC-5520 Transportation rackmount server specifically to handle passenger infotainment applications used in trains. With long-term availability, this application-ready standard platform combines up to two Intel Xeon 5600 series processors with convenient remote management functionality. The Kontron KISS 4U KTC-5520 Transportation is also compliant to the following rail standards, EN 50155, EN 50121 and EN 600...
Molex delivers full range of energy efficient, affordable and safe Lighting Solutions
Molex Incorporated continues its commitment to grow its lighting portfolio by drawing on the company’s expertise in the connector and electronics business. Molex has a long history of tapping into its core capabilities to develop innovative products for a wide variety of industries, including telecommunications, medical and military/aerospace.
VPG Releases HTH Foil Resistors With Operating Temperature up to +240°C, TCR of ±1 ppm/°C, and Load-Life Stability to ±0.05% at +220°C
Vishay Precision Group, Inc., announced that its Vishay Foil Resistors division (VFR) has introduced a new series of ultra-high-precision Bulk Metal Z1-Foil hybrid surface-mount chip resistors connected using gold wire bonding. The HTH series is designed for high-temperature applications to +240°C and offers improved heat dissipation, providing nearly a 100°C extension in operating temperature range over precision thin film chip resistors.
CTIA Over-the-Air (OTA) Audit successfully passed
CETECOM has demonstrated as one of the first laboratories worldwide a high-class expertise and state-of-the-art equipment in the field of newest OTA requirements like artificial hands, A-GPS and notebooks.
Mixed-Signal Interconnect Solution for Semiconductor Device Probers and Characterization Equipment now Available from Keithley
Keithley Instruments has introduced what it says is the test industry’s only cabling solutions capable of handling I-V, C-V, and pulsed I-V signals with a single set of cables (patent pending). The new cabling kits are based on a patent-pending design that speeds and simplifies the process of making DC Current‑Voltage (I‑V), Capacitance‑Voltage (C‑V), and pulsed I‑V testing connections from any modern semiconductor...
Altium further extends FPGA-based design
Altium has announced another new daughter board for its desktop NanoBoard reconfigurable hardware development platform. This latest plug-in daughter board targets features Altera’s low-cost Cyclone III EP3C40 FPGA in a 780 BGA package. The daughter board includes a range of on-board memories for application use and a 1-Wire memory device used to store board identification and related information.
Kontron Embedded Application Programming Interface: Unified middleware for simplified access and control of hardware resources
Kontron is premiering its new cross-platform middleware, Kontron Embedded Application Programming Interface (Kontron EAPI), at this year's SPS/IPC/DRIVES fair in Nuremberg, Germany. With this launch, Kontron has standardized the access and control of hardware resources for embedded applications.
ACCES I/O Products launches its NANO I/O Server Core Duo at Embedded Systems Conference
ACCES I/O Products introduced the NANO I/O Server CD (Core Duo) at the Embedded Systems Conference Boston. This fanless system is one of the smallest embedded systems available featuring an Intel Core Duo 1.66GHz CPU. The system was designed to support an extensive collection of available COTS PC/104 modules and external USB I/O devices.
congatec's Qseven starter kit for mobile embedded applications
congatec's Qseven Mobility Starter Kit is a complete rapid prototyping package for battery-powered, embedded systems. The compact size and low power consumption of Qseven embedded computer modules makes them ideally suited for almost all ultra-mobile, embedded PC applications. In order to minimise the development effort required for such systems, congatec has bundled all the necessary components in a comprehensive starter kit.
ON Semiconductor Expands ESD Protection Technology into Industry’s Smallest Package for Use in Portable Electronics Applications
ON Semiconductor has introduced two ESD protection devices housed in its new, ultra-small 0201 Dual Silicon No-Lead (DSN-2) package. The DSN style package, which measures a mere 0.6 mm x 0.3 mm x 0.3 mm, enables 100 percent utilization of the package area for active silicon, offering a significant performance-per-board-area advantage compared with products in plastic molded packages.